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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: TSPC860SRVZP50D under Microprocessors

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Select Parts		Part Number

		TSPC860SRVZP50D e2v technologies
		TSPC860SRVZP50D Atmel Corporation

			Most Relevant							Technical									Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

S-PBGA-B357

Not Qualified

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.05 mm

25 mm

25 mm

TELEDYNE E2V (UK) LTD

BGA

BGA,

357

compliant

3A991.A.2

8542.31.00.01

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No

Transferred

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

INDUSTRIAL

S-PBGA-B357

Not Qualified

e0

110 °C

-40 °C

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.05 mm

25 mm

25 mm

ATMEL CORP

BGA

BGA, BGA357,19X19,50

357

unknown

3A991.A.2

8542.31.00.01

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Microcontrollers and Processors

TSPC860SRVZP50D

e2v technologies

Check for Price

Obsolete

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

S-PBGA-B357

Not Qualified

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.05 mm

25 mm

25 mm

TELEDYNE E2V (UK) LTD

BGA

BGA,

357

compliant

3A991.A.2

8542.31.00.01

Microcontrollers and Processors

TSPC860SRVZP50D

Atmel Corporation

Check for Price

No

Transferred

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

INDUSTRIAL

S-PBGA-B357

Not Qualified

e0

110 °C

-40 °C

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.05 mm

25 mm

25 mm

ATMEL CORP

BGA

BGA, BGA357,19X19,50

357

unknown

3A991.A.2

8542.31.00.01