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Parametric results for: TSPC860 under Microprocessors

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Manufacturer Part Number: tspc860
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TSPC860MHMGU40A3
 Teledyne e2v 		Check for Price Obsolete 32 40 MHz 32 32 40 MHz YES 3.3 V MICROPROCESSOR CMOS YES FIXED POINT YES NO 3.465 V 3.135 V MILITARY S-CBGA-B357 Not Qualified 125 °C -55 °C 357 CERAMIC, METAL-SEALED COFIRED SQUARE GRID ARRAY BALL BOTTOM ATMEL GRENOBLE BGA , 357 unknown 3A991.A.2 8542.31.00.01
TSPC860MHVGU/T40C
 Teledyne e2v 		Check for Price Obsolete 32 40 MHz 32 32 40 MHz YES 3.3 V MICROPROCESSOR CMOS YES FIXED POINT YES NO 3.465 V 3.135 V INDUSTRIAL S-CBGA-B357 Not Qualified 110 °C -40 °C 357 CERAMIC, METAL-SEALED COFIRED SQUARE GRID ARRAY BALL BOTTOM ATMEL GRENOBLE BGA , 357 unknown 3A991.A.2 8542.31.00.01
TSPC860MHVG40A3
 Teledyne e2v 		Check for Price Obsolete 32 40 MHz 32 32 40 MHz YES 3.3 V MICROPROCESSOR CMOS YES FIXED POINT YES NO 3.465 V 3.135 V INDUSTRIAL S-CBGA-B357 Not Qualified 110 °C -40 °C 357 CERAMIC, METAL-SEALED COFIRED SQUARE GRID ARRAY BALL BOTTOM ATMEL GRENOBLE BGA , 357 unknown 3A991.A.2 8542.31.00.01
TSPC860MHMZPU50C
 Teledyne e2v 		Check for Price Obsolete 32 50 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES NO 3.465 V 3.135 V MILITARY S-PBGA-B357 Not Qualified 125 °C -55 °C 357 PLASTIC/EPOXY SQUARE GRID ARRAY BALL BOTTOM ATMEL GRENOBLE BGA , 357 unknown 3A991.A.2 8542.31.00.01
TS860SRVZQU66D
 Teledyne e2v 		Check for Price Obsolete MICROPROCESSOR, RISC TELEDYNE E2V (UK) LTD compliant 8542.31.00.01
TSPC860MHMGU40B
 Teledyne e2v 		Check for Price Obsolete 32 40 MHz 32 32 40 MHz YES 3.3 V MICROPROCESSOR CMOS YES FIXED POINT YES NO 3.465 V 3.135 V MILITARY S-CBGA-B357 Not Qualified 125 °C -55 °C 357 CERAMIC, METAL-SEALED COFIRED SQUARE GRID ARRAY BALL BOTTOM ATMEL GRENOBLE BGA , 357 unknown 3A991.A.2 8542.31.00.01
TSPC860MHMG40B
 Thales Group 		Check for Price Transferred 32 40 MHz 32 32 40 MHz YES 3.3 V MICROPROCESSOR CMOS YES FIXED POINT YES NO 3.465 V 3.135 V MILITARY S-CBGA-B357 Not Qualified 125 °C -55 °C 357 CERAMIC, METAL-SEALED COFIRED SQUARE GRID ARRAY BALL BOTTOM THOMSON-CSF SEMICONDUCTORS BGA , 357 unknown 3A991.A.2 8542.31.00.01
TSPC860SRVZPU80D4
 Atmel Corporation 		Check for Price Transferred 32 80 MHz 32 32 80 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 Not Qualified 357 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 2.05 mm 25 mm 25 mm ATMEL CORP BGA BGA, 357 unknown 3A991.A.2 8542.31.00.01
TSPC860SRMZP66D
 Atmel Corporation 		Check for Price No Transferred 32 66 MHz 32 32 66 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V MILITARY S-PBGA-B357 Not Qualified e0 125 °C -55 °C 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.05 mm 25 mm 25 mm ATMEL CORP BGA PLASTIC, BGA-357 357 unknown 3A991.A.2 8542.31.00.01
TSPC860MHVZPU40C
 Thales Group 		Check for Price Transferred 32 40 MHz 32 32 40 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES NO 3.465 V 3.135 V INDUSTRIAL S-PBGA-B357 Not Qualified 110 °C -40 °C 357 PLASTIC/EPOXY SQUARE GRID ARRAY BALL BOTTOM THOMSON-CSF SEMICONDUCTORS BGA , 357 unknown 3A991.A.2 8542.31.00.01
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