Findchips: Parametric Search Results for TS80C186EB13


Select Parts		Part Number

		TS80C186EB13 Rochester Electronics LLC
		TS80C186EB-13 Intel Corporation
		TS80C186EB13 Intel Corporation

				Most Relevant								Technical													Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	RAM (words)	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Number of External Interrupts	Number of Serial I/Os	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

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Active

13 MHz

26 MHz

YES

5 V

MICROPROCESSOR

CMOS

DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE

FIXED POINT

YES

5.5 V

4.5 V

INDUSTRIAL

R-PQFP-G80

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

TIN LEAD

GULL WING

800 µm

QUAD

3.15 mm

14 mm

20 mm

ROCHESTER ELECTRONICS LLC

QFP

QFP,

unknown

3A991.A.2

8542.31.00.01

Check for Price

Obsolete

13 MHz

26 MHz

YES

5 V

MICROPROCESSOR

CMOS

FIXED POINT

YES

73 mA

5.5 V

4.5 V

INDUSTRIAL

R-PQFP-G80

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

TIN LEAD

GULL WING

800 µm

QUAD

3.15 mm

14 mm

20 mm

INTEL CORP

QFP

QFP,

unknown

Check for Price

Obsolete

13 MHz

26 MHz

YES

5 V

MICROPROCESSOR

CMOS

DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE

FIXED POINT

YES

73 mA

5.5 V

4.5 V

INDUSTRIAL

R-PQFP-G80

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

TIN LEAD

GULL WING

800 µm

QUAD

3.15 mm

14 mm

20 mm

INTEL CORP

QFP

EIAJ, QFP-80

unknown

3A991.A.2

8542.31.00.01

Intel

Compare

TS80C186EB13

Rochester Electronics LLC

Check for Price

Active

13 MHz

26 MHz

YES

5 V

MICROPROCESSOR

CMOS

DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE

FIXED POINT

YES

5.5 V

4.5 V

INDUSTRIAL

R-PQFP-G80

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

TIN LEAD

GULL WING

800 µm

QUAD

3.15 mm

14 mm

20 mm

ROCHESTER ELECTRONICS LLC

QFP

QFP,

unknown

3A991.A.2

8542.31.00.01

TS80C186EB-13

Intel Corporation

Check for Price

Obsolete

13 MHz

26 MHz

YES

5 V

MICROPROCESSOR

CMOS

FIXED POINT

YES

73 mA

5.5 V

4.5 V

INDUSTRIAL

R-PQFP-G80

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

TIN LEAD

GULL WING

800 µm

QUAD

3.15 mm

14 mm

20 mm

INTEL CORP

QFP

QFP,

unknown

TS80C186EB13

Intel Corporation

Check for Price

Obsolete

13 MHz

26 MHz

YES

5 V

MICROPROCESSOR

CMOS

DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE

FIXED POINT

YES

73 mA

5.5 V

4.5 V

INDUSTRIAL

R-PQFP-G80

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

TIN LEAD

GULL WING

800 µm

QUAD

3.15 mm

14 mm

20 mm

INTEL CORP

QFP

EIAJ, QFP-80

unknown

3A991.A.2

8542.31.00.01

Intel

Parametric results for: TS80C186EB13 under Microprocessors