Parametric results for: THGBMHG9C8LBAAG under Other Memory ICs

All Filters JESD-30 Code Manufacturer Memory Density Memory IC Type Memory Width Number of Functions Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Package Body Material Package Code Package Shape Package Style

R-PBGA-B 1

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Manufacturer (1)

Toshiba America Electronic Components 1

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Memory Density (1)

549.7558 Gbit 1

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MEMORY CIRCUIT 1

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Memory Width (1)

8 1

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1.0 1

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68.7195 G 1

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6.4E10 1

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ASYNCHRONOUS 1

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85.0 °C 1

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-40.0 °C 1

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Organization (1)

64GX8 1

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PLASTIC/EPOXY 1

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BGA 1

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RECTANGULAR 1

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GRID ARRAY 1

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