Parametric results for: TFF11142HN under Other Telecom ICs
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TFF11142HN
NXP Semiconductors
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Check for Price | Obsolete | 3.3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N24 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | NXP SEMICONDUCTORS | HVQCCN, | unknown | 8542.39.00.01 | |||||||||
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TFF11142HN/N1,111
NXP Semiconductors
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Check for Price | Yes | Obsolete | 3.3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N24 | 1 | 85 °C | -40 °C | 260 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | NXP SEMICONDUCTORS | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-1, HVQFN-24 | compliant | QFN | 24 | SOT616-1 | NXP | |||
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TFF11142HN/N1X
NXP Semiconductors
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Check for Price | Yes | Obsolete | 3.3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N24 | 1 | 85 °C | -40 °C | 260 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | NXP SEMICONDUCTORS | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-1, HVQFN-24 | compliant | QFN | 24 | SOT616-1 | NXP |