Parametric results for: TD27C256-2 under EPROMs

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Manufacturer Part Number: td27c2562
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TD27C256-200V10
Intel Corporation
Check for Price No No Obsolete 262.144 kbit 8 32KX8 5 V 200 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-GDIP-T28 Not Qualified e0 85 °C -40 °C 28 CERAMIC, GLASS-SEALED WDIP DIP28,.6 RECTANGULAR IN-LINE, WINDOW NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.72 mm 37.15 mm 15.24 mm INTEL CORP DIP WINDOWED, CERDIP-28 28 unknown EAR99 8542.32.00.61
TD27C256-25
Intel Corporation
Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 250 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 30 µA CMOS INDUSTRIAL R-XDIP-T28 Not Qualified e0 85 °C -40 °C 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL INTEL CORP DIP-28 unknown EAR99 8542.32.00.61
TD27C256-2
Intel Corporation
Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 200 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 30 µA CMOS INDUSTRIAL R-XDIP-T28 Not Qualified e0 85 °C -40 °C 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL INTEL CORP DIP-28 unknown EAR99 8542.32.00.61
TD27C256-20
Intel Corporation
Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 200 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 30 µA CMOS INDUSTRIAL R-XDIP-T28 Not Qualified e0 85 °C -40 °C 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL INTEL CORP DIP-28 unknown EAR99 8542.32.00.61
TD27C256-2
Rochester Electronics LLC
Check for Price No Active 262.144 kbit 8 32KX8 5 V 120 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 1 mA 30 µA 5.5 V 4.5 V CMOS 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED ROCHESTER ELECTRONICS LLC unknown EAR99 8542.32.00.61
TD27C256-200V10
Rochester Electronics LLC
Check for Price Obsolete 262.144 kbit 8 32KX8 5 V 200 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 1 mA 30 µA 5.5 V 4.5 V CMOS 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED ROCHESTER ELECTRONICS LLC , unknown EAR99 8542.32.00.61
TD27C256-20
Rochester Electronics LLC
Check for Price No Active 262.144 kbit 8 32KX8 5 V 120 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 1 mA 30 µA 5.5 V 4.5 V CMOS 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED ROCHESTER ELECTRONICS LLC unknown EAR99 8542.32.00.61
TD27C256-25
Rochester Electronics LLC
Check for Price No Active 262.144 kbit 8 32KX8 5 V 120 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 1 mA 30 µA 5.5 V 4.5 V CMOS 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED ROCHESTER ELECTRONICS LLC unknown EAR99 8542.32.00.61
TD27C256-250
Intel Corporation
Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 250 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 30 µA CMOS INDUSTRIAL R-XDIP-T28 Not Qualified e0 85 °C -40 °C 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL INTEL CORP DIP, DIP28,.6 compliant EAR99 8542.32.00.61
TD27C256-200
Intel Corporation
Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 200 ns UVPROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 30 µA CMOS INDUSTRIAL R-XDIP-T28 Not Qualified e0 85 °C -40 °C 28 CERAMIC DIP DIP28,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL INTEL CORP DIP, DIP28,.6 compliant EAR99 8542.32.00.61