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Parametric » Converters » Analog to Digital Converters

Parametric results for: TC850IJL under Analog to Digital Converters

Select parts from the table below to compare.

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Select Parts		Part Number

		TC850IJL Telcom Semiconductor Inc
		TC850IJL Teledyne Technologies Inc
		TC850IJL Microchip Technology Inc

			Most Relevant						Technical									Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Analog Input Voltage-Max	Number of Analog In Channels	Linearity Error-Max (EL)	Number of Bits	Surface Mount	Converter Type	Analog Input Voltage-Min	Negative Supply Voltage-Nom	Number of Functions	Output Bit Code	Supply Current-Max	Technology	Temperature Grade	Output Format	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Seated Height-Max	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count

Check for Price

No

Transferred

5 V

3.28 V

1

0.0061 %

15

NO

ADC, MULTI-SLOPE

-5 V

1

BINARY

3.5 mA

CMOS

OTHER

PARALLEL, 8 BITS

R-GDIP-T40

Not Qualified

e0

85 °C

-25 °C

40

CERAMIC, GLASS-SEALED

DIP

DIP40,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

TELCOM SEMICONDUCTOR INC

CERDIP-40

unknown

8542.39.00.01

Check for Price

Obsolete

5 V

5 V

1

0.006 %

15

NO

ADC, MULTI-SLOPE

-5 V

-5 V

1

OFFSET BINARY

3.5 mA

CMOS

OTHER

PARALLEL, 8 BITS

R-GDIP-T40

Not Qualified

85 °C

-25 °C

40

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

DUAL

TELEDYNE COMPONENTS

,

unknown

8542.39.00.01

Check for Price

Yes

Obsolete

5 V

3.5 V

1

0.0061 %

15

NO

ADC, MULTI-SLOPE

-3.5 V

-5 V

1

BINARY

CMOS

OTHER

PARALLEL, 8 BITS

R-GDIP-T40

Not Qualified

e3

85 °C

-25 °C

40

CERAMIC, GLASS-SEALED

DIP

DIP40,.6

RECTANGULAR

IN-LINE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

15.24 mm

5.33 mm

52.07 mm

MICROCHIP TECHNOLOGY INC

DIP, DIP40,.6

compliant

8542.39.00.01

DIP

40

Compare

Telcom Semiconductor Inc

Check for Price

No

Transferred

5 V

3.28 V

1

0.0061 %

15

NO

ADC, MULTI-SLOPE

-5 V

1

BINARY

3.5 mA

CMOS

OTHER

PARALLEL, 8 BITS

R-GDIP-T40

Not Qualified

e0

85 °C

-25 °C

40

CERAMIC, GLASS-SEALED

DIP

DIP40,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

TELCOM SEMICONDUCTOR INC

CERDIP-40

unknown

8542.39.00.01

Teledyne Technologies Inc

Check for Price

Obsolete

5 V

5 V

1

0.006 %

15

NO

ADC, MULTI-SLOPE

-5 V

-5 V

1

OFFSET BINARY

3.5 mA

CMOS

OTHER

PARALLEL, 8 BITS

R-GDIP-T40

Not Qualified

85 °C

-25 °C

40

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

DUAL

TELEDYNE COMPONENTS

,

unknown

8542.39.00.01

Microchip Technology Inc

Check for Price

Yes

Obsolete

5 V

3.5 V

1

0.0061 %

15

NO

ADC, MULTI-SLOPE

-3.5 V

-5 V

1

BINARY

CMOS

OTHER

PARALLEL, 8 BITS

R-GDIP-T40

Not Qualified

e3

85 °C

-25 °C

40

CERAMIC, GLASS-SEALED

DIP

DIP40,.6

RECTANGULAR

IN-LINE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

15.24 mm

5.33 mm

52.07 mm

MICROCHIP TECHNOLOGY INC

DIP, DIP40,.6

compliant

8542.39.00.01

DIP

40