Parametric results for: T8102 under Other Telecom ICs
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T8102(217PBGA)
LSI Corporation
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Check for Price | Obsolete | AGERE SYSTEMS INC | , | unknown | ||||||||||||||||||||||||||||||||||
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T8102---SC3-DB
LSI Corporation
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Check for Price | No | Transferred | 70 °C | YES | LUCENT TECHNOLOGIES INC | , | unknown | QFP | 208 | 8542.39.00.01 | S-PQFP-G208 | 1 | 208 | PLASTIC/EPOXY | SQUARE | FLATPACK | Not Qualified | 3.3 V | TIME SLOT ASSIGNER | COMMERCIAL | GULL WING | QUAD | ||||||||||||||||
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T8102(208SQFP)
LSI Corporation
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Check for Price | Obsolete | AGERE SYSTEMS INC | , | unknown | ||||||||||||||||||||||||||||||||||
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T8102---BAL3-DB
LSI Corporation
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Check for Price | No | No | Transferred | e0 | -40 °C | 85 °C | YES | TIN LEAD | LSI CORP | BGA, | compliant | BGA | 217 | 8542.39.00.01 | S-PBGA-B217 | 1 | 217 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | Not Qualified | 3.3 V | TIME SLOT ASSIGNER | INDUSTRIAL | BALL | BOTTOM | 23 mm | BGA | 2.32 mm | 1.27 mm | 23 mm | |||||||
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T-8102---SC4-DB
Broadcom Limited
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Check for Price | No | Active | e0 | 70 °C | YES | TIN LEAD | BROADCOM INC | PLASTIC, SQFP-208 | unknown | 8542.39.00.01 | S-PQFP-G208 | 1 | 208 | PLASTIC/EPOXY | SQUARE | FLATPACK, FINE PITCH | Not Qualified | 3.3 V | TIME SLOT ASSIGNER | COMMERCIAL | GULL WING | QUAD | 28 mm | FQFP | 4.1 mm | 500 µm | 28 mm | QFP208,1.2SQ,20 | 275 mA | |||||||||
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T8102---SC-DB
LSI Corporation
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Check for Price | No | No | Transferred | e0 | 70 °C | YES | TIN LEAD | LSI CORP | FQFP, | compliant | QFP | 208 | 8542.39.00.01 | S-PQFP-G208 | 1 | 208 | PLASTIC/EPOXY | SQUARE | FLATPACK, FINE PITCH | Not Qualified | 3.3 V | TIME SLOT ASSIGNER | COMMERCIAL | GULL WING | QUAD | 28 mm | FQFP | 4.1 mm | 500 µm | 28 mm | ||||||||
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T8102---BAL3-DB
Broadcom Limited
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Check for Price | Active | e0 | -40 °C | 85 °C | YES | TIN LEAD | BROADCOM INC | PLASTIC, BGA-217 | compliant | 8542.39.00.01 | S-PBGA-B217 | 1 | 217 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | Not Qualified | 3.3 V | TIME SLOT ASSIGNER | INDUSTRIAL | BALL | BOTTOM | 23 mm | BGA | 2.32 mm | 1.27 mm | 23 mm | 275 mA | 225 | 30 | ||||||||
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T8102---BAL3-DB
Avago Technologies
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Check for Price | Active | e0 | -40 °C | 85 °C | YES | TIN LEAD | AVAGO TECHNOLOGIES INC | BGA, | unknown | 8542.39.00.01 | S-PBGA-B217 | 1 | 217 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | Not Qualified | 3.3 V | TIME SLOT ASSIGNER | INDUSTRIAL | BALL | BOTTOM | 23 mm | BGA | 2.32 mm | 1.27 mm | 23 mm | 275 mA | 225 | 30 | ||||||||
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T8102---SC-DB
Avago Technologies
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Check for Price | Active | e0 | 70 °C | YES | TIN LEAD | AVAGO TECHNOLOGIES INC | FQFP, | unknown | 8542.39.00.01 | S-PQFP-G208 | 1 | 208 | PLASTIC/EPOXY | SQUARE | FLATPACK, FINE PITCH | Not Qualified | 3.3 V | TIME SLOT ASSIGNER | COMMERCIAL | GULL WING | QUAD | 28 mm | FQFP | 4.1 mm | 500 µm | 28 mm | 275 mA | 225 | 30 | |||||||||
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T8102---BAL-DB
LSI Corporation
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Check for Price | No | No | Transferred | e0 | -40 °C | 85 °C | YES | Tin/Lead (Sn/Pb) | LUCENT TECHNOLOGIES INC | BGA, BGA217,17X17,50 | unknown | BGA | 217 | 8542.39.00.01 | S-PBGA-B217 | 1 | 217 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | Not Qualified | 3.3 V | TIME SLOT ASSIGNER | INDUSTRIAL | BALL | BOTTOM | BGA | 1.27 mm | BGA217,17X17,50 | 275 µA | CMOS |