Parametric results for: T5753 under Other Telecom ICs
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T5753C-6AQJ
Microchip Technology Inc
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Check for Price | Yes | Active | 3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 11.6 µA | AUTOMOTIVE | S-PDSO-G8 | Not Qualified | 125 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | MICROCHIP TECHNOLOGY INC | LEAD FREE, TSSOP-8 | compliant | 8542.39.00.01 | |||||||||||
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T5753C-6AQJ-66
Microchip Technology Inc
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Check for Price | Yes | Yes | Obsolete | 3 V | TELECOM CIRCUIT | 1 | MILITARY | S-PDSO-G8 | e3 | 125 °C | -55 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | MICROCHIP TECHNOLOGY INC | TSSOP-8 | compliant | 8542.31.00.01 | 5A991.G | Microchip | |||||||||
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T5753-6AP
Atmel Corporation
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Check for Price | No | Obsolete | BIPOLAR | 11.6 mA | AUTOMOTIVE | R-PDSO-G8 | e0 | Not Qualified | 1 | 125 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | ATMEL CORP | unknown | 8542.39.00.01 | |||||||||||||||
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T5753C-6APJ
Microchip Technology Inc
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Check for Price | Yes | Active | 3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 11.6 µA | AUTOMOTIVE | S-PDSO-G8 | Not Qualified | 125 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | MICROCHIP TECHNOLOGY INC | LEAD FREE, TSSOP-8 | compliant | 8542.39.00.01 | |||||||||||
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T5753-6AQ
Atmel Corporation
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Check for Price | No | Obsolete | 3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 11.6 µA | AUTOMOTIVE | S-PDSO-G8 | e0 | Not Qualified | 1 | 125 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.1 mm | ATMEL CORP | TSSOP, TSSOP8,.19 | compliant | 8542.39.00.01 | SOIC | 8 | ||||||
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T5753C-6AQJ
Atmel Corporation
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Check for Price | Yes | Transferred | 3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 11.6 µA | AUTOMOTIVE | S-PDSO-G8 | Not Qualified | 125 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | ATMEL CORP | TSSOP, TSSOP8,.19 | compliant | 8542.39.00.01 | |||||||||||
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T5753C-6APJ
Atmel Corporation
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Check for Price | Yes | Transferred | 3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 11.6 µA | AUTOMOTIVE | S-PDSO-G8 | Not Qualified | 125 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | ATMEL CORP | TSSOP, TSSOP8,.19 | compliant | 8542.39.00.01 | |||||||||||
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T5753-6APJ
Atmel Corporation
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Check for Price | Yes | Obsolete | 3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 11.6 µA | AUTOMOTIVE | S-PDSO-G8 | e3 | Not Qualified | 1 | 125 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | ATMEL CORP | LEAD FREE, TSSOP-8 | unknown | 8542.39.00.01 | Microchip | SOIC | 8 | ||||
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T5753-6AQJ
Atmel Corporation
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Check for Price | Yes | Obsolete | 3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 11.6 µA | AUTOMOTIVE | S-PDSO-G8 | e3 | Not Qualified | 1 | 125 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | ATMEL CORP | TSSOP, TSSOP8,.19 | compliant | 8542.39.00.01 | SOIC | 8 |