Findchips: Parametric Search Results for SSTU32866B


Select Parts		Part Number

		CY2SSTU32866BFXCT Silicon Laboratories Inc
		IDT74SSTU32866BBFG8 Integrated Device Technology Inc
		CY2SSTU32866BFXC Silicon Laboratories Inc
		74SSTU32866BBFG Renesas Electronics Corporation
		74SSTU32866BBFG Integrated Device Technology Inc
		IDT74SSTU32866BBFG Integrated Device Technology Inc
		CY2SSTU32866BFXCT Cypress Semiconductor
		74SSTU32866BBFG8 Integrated Device Technology Inc
		CY2SSTU32866BFXC Cypress Semiconductor

				Most Relevant								Technical								Compliance			Operating Conditions				Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Number of Functions	Number of Bits	Surface Mount	Package Code	Trigger Type	Family	Logic IC Type	Technology	Additional Feature	fmax-Min	Output Polarity	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code	Manufacturer Package Code	ECCN Code	Samacsys Manufacturer

Check for Price

Yes

Obsolete

1.8 V

1.87 ns

YES

TFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

500 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

BALL

800 µm

BOTTOM

1.2 mm

5.5 mm

13.5 mm

SPECTRALINEAR INC

BGA

13.50 X 5.50 MM, 1.20 MM HEIGHT, LEADFREE, MO-205, FBGA-96

compliant

8542.39.00.01

Check for Price

Yes

Obsolete

1.8 V

2.15 ns

YES

LFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

TTL

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

270 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

PLASTIC/EPOXY

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.5 mm

5.5 mm

13.5 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LFBGA, BGA96,6X16,32

unknown

8542.39.00.01

Check for Price

Yes

Obsolete

1.8 V

1.87 ns

YES

TFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

500 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

BALL

800 µm

BOTTOM

1.2 mm

5.5 mm

13.5 mm

SPECTRALINEAR INC

BGA

13.50 X 5.50 MM, 1.20 MM HEIGHT, LEADFREE, MO-205, FBGA-96

compliant

8542.39.00.01

Check for Price

Yes

Obsolete

BUS DRIVER

260

TIN SILVER COPPER

RENESAS ELECTRONICS CORP

CABGA

LFBGA-96

compliant

8542390000

BFG96

NLR

Renesas Electronics

Check for Price

Yes

Obsolete

1.8 V

2.15 ns

YES

LFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

270 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

PLASTIC/EPOXY

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.5 mm

5.5 mm

13.5 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

GREEN, LFBGA-96

unknown

8542.39.00.01

BFG96

Check for Price

Yes

Obsolete

1.8 V

2.15 ns

YES

LFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

TTL

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

270 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

PLASTIC/EPOXY

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.5 mm

5.5 mm

13.5 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LFBGA, BGA96,6X16,32

unknown

8542.39.00.01

Check for Price

Yes

Transferred

1.8 V

1.87 ns

YES

TFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

500 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

5.5 mm

13.5 mm

CYPRESS SEMICONDUCTOR CORP

BGA

13.50 X 5.50 MM, 1.20 MM HEIGHT, LEADFREE, MO-205, FBGA-96

compliant

8542.39.00.01

Check for Price

Yes

Obsolete

1.8 V

2.15 ns

YES

LFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

TTL

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

270 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

PLASTIC/EPOXY

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.5 mm

5.5 mm

13.5 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

GREEN, LFBGA-96

unknown

8542.39.00.01

BFG96

Check for Price

Yes

Transferred

1.8 V

1.87 ns

YES

TFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

500 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

5.5 mm

13.5 mm

CYPRESS SEMICONDUCTOR CORP

BGA

13.50 X 5.50 MM, 1.20 MM HEIGHT, LEADFREE, MO-205, FBGA-96

compliant

8542.39.00.01

Compare

CY2SSTU32866BFXCT

Silicon Laboratories Inc

Check for Price

Yes

Obsolete

1.8 V

1.87 ns

YES

TFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

500 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

BALL

800 µm

BOTTOM

1.2 mm

5.5 mm

13.5 mm

SPECTRALINEAR INC

BGA

13.50 X 5.50 MM, 1.20 MM HEIGHT, LEADFREE, MO-205, FBGA-96

compliant

8542.39.00.01

IDT74SSTU32866BBFG8

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

1.8 V

2.15 ns

YES

LFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

TTL

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

270 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

PLASTIC/EPOXY

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.5 mm

5.5 mm

13.5 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LFBGA, BGA96,6X16,32

unknown

8542.39.00.01

CY2SSTU32866BFXC

Silicon Laboratories Inc

Check for Price

Yes

Obsolete

1.8 V

1.87 ns

YES

TFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

500 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

BALL

800 µm

BOTTOM

1.2 mm

5.5 mm

13.5 mm

SPECTRALINEAR INC

BGA

13.50 X 5.50 MM, 1.20 MM HEIGHT, LEADFREE, MO-205, FBGA-96

compliant

8542.39.00.01

74SSTU32866BBFG

Renesas Electronics Corporation

Check for Price

Yes

Obsolete

BUS DRIVER

260

TIN SILVER COPPER

RENESAS ELECTRONICS CORP

CABGA

LFBGA-96

compliant

8542390000

BFG96

NLR

Renesas Electronics

74SSTU32866BBFG

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

1.8 V

2.15 ns

YES

LFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

270 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

PLASTIC/EPOXY

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.5 mm

5.5 mm

13.5 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

GREEN, LFBGA-96

unknown

8542.39.00.01

BFG96

IDT74SSTU32866BBFG

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

1.8 V

2.15 ns

YES

LFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

TTL

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

270 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

PLASTIC/EPOXY

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.5 mm

5.5 mm

13.5 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LFBGA, BGA96,6X16,32

unknown

8542.39.00.01

CY2SSTU32866BFXCT

Cypress Semiconductor

Check for Price

Yes

Transferred

1.8 V

1.87 ns

YES

TFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

500 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

5.5 mm

13.5 mm

CYPRESS SEMICONDUCTOR CORP

BGA

13.50 X 5.50 MM, 1.20 MM HEIGHT, LEADFREE, MO-205, FBGA-96

compliant

8542.39.00.01

74SSTU32866BBFG8

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

1.8 V

2.15 ns

YES

LFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

TTL

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

270 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

PLASTIC/EPOXY

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.5 mm

5.5 mm

13.5 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

GREEN, LFBGA-96

unknown

8542.39.00.01

BFG96

CY2SSTU32866BFXC

Cypress Semiconductor

Check for Price

Yes

Transferred

1.8 V

1.87 ns

YES

TFBGA

POSITIVE EDGE

SSTU

D FLIP-FLOP

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

500 MHz

TRUE

1.9 V

1.7 V

COMMERCIAL

R-PBGA-B96

Not Qualified

70 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

5.5 mm

13.5 mm

CYPRESS SEMICONDUCTOR CORP

BGA

13.50 X 5.50 MM, 1.20 MM HEIGHT, LEADFREE, MO-205, FBGA-96

compliant

8542.39.00.01

Parametric results for: SSTU32866B under FF/Latches