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SST39VF3201B-70-4I-EKE
Microchip Technology Inc
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$2.2189 | Yes | Yes | Not Recommended | 33.5544 Mbit | 16 | 2K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 10000 Write/Erase Cycles | 1 | 1 | 1K | 2000000 | 2.0972 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | 20 µA | 45 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.71,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | MICROCHIP TECHNOLOGY INC | TSOP1 | 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 | 48 | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | |||
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SST39VF3201B-70-4I-B3KE
Microchip Technology Inc
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$3.0972 | Yes | Yes | Not Recommended | 33.5544 Mbit | 16 | 2K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 10000 Write/Erase Cycles | 1 | 1 | 1K | 2000000 | 2.0972 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | 20 µA | 45 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | BGA | 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | 48 | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | |||||
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SST39VF3201B-70-4C-B3KE
Microchip Technology Inc
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$3.2350 | Yes | Yes | Not Recommended | 33.5544 Mbit | 16 | 2K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 10000 Write/Erase Cycles | 1 | 1 | 1K | 2000000 | 2.0972 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | 20 µA | 45 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | BGA | 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | 48 | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | ||||||
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SST39VF3201B-70-4C-EKE-T
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 33.5544 Mbit | 16 | 2MX16 | 3 V | 70 ns | FLASH | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | COMMERCIAL | NOR TYPE | R-PDSO-G48 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | MICROCHIP TECHNOLOGY INC | TSOP1 | 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 | 48 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
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SST39VF3201B-70-4I-EKE
Silicon Storage Technology
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Check for Price | Yes | Transferred | 33.5544 Mbit | 16 | 2K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM | YES | YES | YES | 1 | 1K | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 20 µA | 45 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PTSO-G48 | Not Qualified | e3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.71,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | TRIPLE | 1.2 mm | 18.4 mm | 12 mm | SILICON STORAGE TECHNOLOGY INC | TSOP1 | TSOP1, TSSOP48,.71,20 | 48 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||
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SST39VF3201B-70-4C-EKE
Silicon Storage Technology
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Check for Price | Yes | Transferred | 33.5544 Mbit | 16 | 2K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM | YES | YES | YES | 1 | 1K | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 20 µA | 45 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PTSO-G48 | Not Qualified | e3 | 70 °C | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.71,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | TRIPLE | 1.2 mm | 18.4 mm | 12 mm | SILICON STORAGE TECHNOLOGY INC | TSOP1 | 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 | 48 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||
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SST39VF3201B-70-4I-B3KE-T
Microchip Technology Inc
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Check for Price | Yes | Not Recommended | 33.5544 Mbit | 16 | 2K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1K | 2000000 | 2.0972 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | 20 µA | 45 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | |||||||||
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SST39VF3201B-70-4I-EKE-MCL
Microchip Technology Inc
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Check for Price | Not Recommended | 33.5544 Mbit | 16 | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | MICROCHIP TECHNOLOGY INC | TSOP1-48 | compliant | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||||||||||||||||
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SST39VF3201B-70-4C-EKE
Microchip Technology Inc
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Check for Price | Yes | Yes | Not Recommended | 33.5544 Mbit | 16 | 2K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 10000 Write/Erase Cycles | 1 | 1 | 1K | 2000000 | 2.0972 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | 20 µA | 45 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.71,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | MICROCHIP TECHNOLOGY INC | TSOP1 | 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 | 48 | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | ||||
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SST39VF3201B-70-4I-B3KE
Silicon Storage Technology
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Check for Price | Yes | Transferred | 33.5544 Mbit | 16 | 2K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM | YES | YES | YES | 1 | 1K | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 20 µA | 45 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SILICON STORAGE TECHNOLOGY INC | BGA | 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 |