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SST39VF1602C-70-4C-B3KE
Microchip Technology Inc
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$2.1550 | Yes | Yes | Active | 16.7772 Mbit | 16 | 8K,4K,16K,32K | 1MX16 | 3 V | 70 ns | FLASH | TOP BOOT BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 20 µA | 35 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | TS 16949 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | BGA | TFBGA-48 | 48 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||
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SST39VF1602C-70-4C-B3KE
Silicon Storage Technology
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Check for Price | Transferred | 16.7772 Mbit | 16 | 1MX16 | 3 V | 70 ns | FLASH | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | COMMERCIAL | R-PBGA-B48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SILICON STORAGE TECHNOLOGY INC | BGA | TFBGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||||||||||||
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SST39VF1602C-70-4C-B3KE-T
Microchip Technology Inc
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Check for Price | Yes | Active | 16.7772 Mbit | 16 | 8K,4K,16K,32K | 1MX16 | 3 V | 70 ns | FLASH | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 20 µA | 35 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 |