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Parametric » Power Circuits » Power Management Circuits

Parametric results for: SC900841JVK under Power Management Circuits

Select parts from the table below to compare.

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Select Parts		Part Number

		SC900841JVKR2 Freescale Semiconductor
		SC900841JVK NXP Semiconductors
		SC900841JVK Freescale Semiconductor
		SC900841JVKR2 NXP Semiconductors

			Most Relevant						Technical			Compliance		Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

3.6 V

3 V

4.4 V

1

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

S-PBGA-B338

Not Qualified

3

85 °C

-40 °C

260

40

338

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER OVER NICKEL

BALL

706 µm

BOTTOM

11 mm

11 mm

1.2 mm

FREESCALE SEMICONDUCTOR INC

BGA

TFBGA,

338

not_compliant

EAR99

8542.39.00.01

Check for Price

Active

3.6 V

3 V

4.4 V

25

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

S-PBGA-B338

85 °C

-40 °C

338

PLASTIC/EPOXY

TFBGA

BGA338,29X29,14

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

353 µm

BOTTOM

11 mm

11 mm

1.2 mm

NXP SEMICONDUCTORS

TFBGA, BGA338,29X29,14

unknown

EAR99

8542.39.00.01

Check for Price

Yes

Transferred

3.6 V

3 V

4.4 V

1

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

S-PBGA-B338

Not Qualified

3

85 °C

-40 °C

260

40

338

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER OVER NICKEL

BALL

706 µm

BOTTOM

11 mm

11 mm

1.2 mm

FREESCALE SEMICONDUCTOR INC

BGA

TFBGA,

338

not_compliant

EAR99

8542.39.00.01

Check for Price

Active

3.6 V

3 V

4.4 V

25

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

S-PBGA-B338

85 °C

-40 °C

338

PLASTIC/EPOXY

TFBGA

BGA338,29X29,14

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

353 µm

BOTTOM

11 mm

11 mm

1.2 mm

NXP SEMICONDUCTORS

PBGA-338

unknown

EAR99

8542.39.00.01

Compare

Freescale Semiconductor

Check for Price

Yes

Transferred

3.6 V

3 V

4.4 V

1

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

S-PBGA-B338

Not Qualified

3

85 °C

-40 °C

260

40

338

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER OVER NICKEL

BALL

706 µm

BOTTOM

11 mm

11 mm

1.2 mm

FREESCALE SEMICONDUCTOR INC

BGA

TFBGA,

338

not_compliant

EAR99

8542.39.00.01

NXP Semiconductors

Check for Price

Active

3.6 V

3 V

4.4 V

25

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

S-PBGA-B338

85 °C

-40 °C

338

PLASTIC/EPOXY

TFBGA

BGA338,29X29,14

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

353 µm

BOTTOM

11 mm

11 mm

1.2 mm

NXP SEMICONDUCTORS

TFBGA, BGA338,29X29,14

unknown

EAR99

8542.39.00.01

Freescale Semiconductor

Check for Price

Yes

Transferred

3.6 V

3 V

4.4 V

1

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

S-PBGA-B338

Not Qualified

3

85 °C

-40 °C

260

40

338

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER OVER NICKEL

BALL

706 µm

BOTTOM

11 mm

11 mm

1.2 mm

FREESCALE SEMICONDUCTOR INC

BGA

TFBGA,

338

not_compliant

EAR99

8542.39.00.01

NXP Semiconductors

Check for Price

Active

3.6 V

3 V

4.4 V

25

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

S-PBGA-B338

85 °C

-40 °C

338

PLASTIC/EPOXY

TFBGA

BGA338,29X29,14

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

353 µm

BOTTOM

11 mm

11 mm

1.2 mm

NXP SEMICONDUCTORS

PBGA-338

unknown

EAR99

8542.39.00.01