Findchips: Parametric Search Results for S75WS256NDFBFWLK


Select Parts		Part Number

		S75WS256NDFBFWLK Spansion
		S75WS256NDFBFWLK0 Cypress Semiconductor
		S75WS256NDFBFWLK0 Spansion
		S75WS256NDFBFWLK3 Cypress Semiconductor
		S75WS256NDFBFWLK2 Spansion
		S75WS256NDFBFWLK3 Spansion
		S75WS256NDFBFWLK2 Cypress Semiconductor

			Most Relevant				Technical										Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

RAM IS ORGANIZED AS 8M X 16

16000000

16.7772 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

12 mm

9 mm

SPANSION INC

BGA

LFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Active

CYPRESS SEMICONDUCTOR CORP

compliant

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

SRAM ORGANISED AS 128 MB (8M X 16-BIT)

16000000

16.7772 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

9 mm

12 mm

SPANSION INC

BGA

9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84

unknown

EAR99

8542.32.00.71

Check for Price

Active

CYPRESS SEMICONDUCTOR CORP

compliant

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

SRAM ORGANISED AS 128 MB (8M X 16-BIT)

16000000

16.7772 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

9 mm

12 mm

SPANSION INC

BGA

9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

SRAM ORGANISED AS 128 MB (8M X 16-BIT)

16000000

16.7772 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

9 mm

12 mm

SPANSION INC

BGA

9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84

unknown

EAR99

8542.32.00.71

Check for Price

Active

CYPRESS SEMICONDUCTOR CORP

compliant

Compare

S75WS256NDFBFWLK

Spansion

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

RAM IS ORGANIZED AS 8M X 16

16000000

16.7772 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

12 mm

9 mm

SPANSION INC

BGA

LFBGA,

compliant

EAR99

8542.32.00.71

S75WS256NDFBFWLK0

Cypress Semiconductor

Check for Price

Active

CYPRESS SEMICONDUCTOR CORP

compliant

S75WS256NDFBFWLK0

Spansion

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

SRAM ORGANISED AS 128 MB (8M X 16-BIT)

16000000

16.7772 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

9 mm

12 mm

SPANSION INC

BGA

9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84

unknown

EAR99

8542.32.00.71

S75WS256NDFBFWLK3

Cypress Semiconductor

Check for Price

Active

CYPRESS SEMICONDUCTOR CORP

compliant

S75WS256NDFBFWLK2

Spansion

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

SRAM ORGANISED AS 128 MB (8M X 16-BIT)

16000000

16.7772 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

9 mm

12 mm

SPANSION INC

BGA

9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84

unknown

EAR99

8542.32.00.71

S75WS256NDFBFWLK3

Spansion

Check for Price

Yes

Obsolete

268.4355 Mbit

16MX16

1.8 V

MEMORY CIRCUIT

SRAM ORGANISED AS 128 MB (8M X 16-BIT)

16000000

16.7772 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

9 mm

12 mm

SPANSION INC

BGA

9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84

unknown

EAR99

8542.32.00.71

S75WS256NDFBFWLK2

Cypress Semiconductor

Check for Price

Active

CYPRESS SEMICONDUCTOR CORP

compliant

Parametric results for: S75WS256NDFBFWLK under Other Memory ICs