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Manufacturer Part Number: s72ws256nd0bfwbb
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S72WS256ND0BFWBB0
 Cypress Semiconductor 		Check for Price Active CYPRESS SEMICONDUCTOR CORP compliant
S72WS256ND0BFWBB0
 Spansion 		Check for Price Yes Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT MOBILE SDRAM IS ORGANIZED AS 2M X 16BIT ... more 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B137 Not Qualified e1 3 85 °C -25 °C 260 40 137 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12 mm 9 mm SPANSION INC unknown BGA 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137 137 EAR99 8542.32.00.71
S72WS256ND0BFWBB3
 Spansion 		Check for Price Yes Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT MOBILE SDRAM IS ORGANIZED AS 2M X 16BIT ... more 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B137 Not Qualified e1 3 85 °C -25 °C 260 40 137 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12 mm 9 mm SPANSION INC unknown BGA 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137 137 EAR99 8542.32.00.71
S72WS256ND0BFWBB2
 Spansion 		Check for Price Yes Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT MOBILE SDRAM IS ORGANIZED AS 2M X 16BIT ... more 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B137 Not Qualified e1 3 85 °C -25 °C 260 40 137 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12 mm 9 mm SPANSION INC unknown BGA 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137 137 EAR99 8542.32.00.71
S72WS256ND0BFWBB3
 AMD 		Check for Price Yes Active 1.8 V 70 ns MEMORY CIRCUIT FLASH+SDRAM 40 µA 60 µA CMOS OTHER R-PBGA-B137 Not Qualified 85 °C -25 °C 137 PLASTIC/EPOXY FBGA BGA137,10X14,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC compliant FBGA, BGA137,10X14,32 EAR99 8542.32.00.71
S72WS256ND0BFWBB0
 AMD 		Check for Price Yes Active 1.8 V 70 ns MEMORY CIRCUIT FLASH+SDRAM 40 µA 60 µA CMOS OTHER R-PBGA-B137 Not Qualified 85 °C -25 °C 137 PLASTIC/EPOXY FBGA BGA137,10X14,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC compliant FBGA, BGA137,10X14,32 EAR99 8542.32.00.71
S72WS256ND0BFWBB2
 Cypress Semiconductor 		Check for Price Active CYPRESS SEMICONDUCTOR CORP compliant
S72WS256ND0BFWBB2
 AMD 		Check for Price Yes Active 1.8 V 70 ns MEMORY CIRCUIT FLASH+SDRAM 40 µA 60 µA CMOS OTHER R-PBGA-B137 Not Qualified 85 °C -25 °C 137 PLASTIC/EPOXY FBGA BGA137,10X14,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC compliant FBGA, BGA137,10X14,32 EAR99 8542.32.00.71
S72WS256ND0BFWBB3
 Cypress Semiconductor 		Check for Price Active CYPRESS SEMICONDUCTOR CORP compliant