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S71PL129JA0BAI9P4
AMD
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Check for Price | Yes | Active | 70 ns | MEMORY CIRCUIT | FLASH+PSRAM | 5 µA | 70 µA | CMOS | INDUSTRIAL | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | FBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA64,10X12,32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||
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S71PL129JA0BAI9P2
AMD
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Check for Price | Yes | Active | 70 ns | MEMORY CIRCUIT | FLASH+PSRAM | 5 µA | 70 µA | CMOS | INDUSTRIAL | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | FBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA64,10X12,32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||
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S71PL129JA0BAI9P3
Spansion
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Check for Price | No | Obsolete | 134.2177 Mbit | 16 | 8MX16 | 3 V | MEMORY CIRCUIT | PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16 | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | 3.1 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B64 | Not Qualified | e0 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 11.6 mm | 8 mm | SPANSION INC | TFBGA, | compliant | EAR99 | 8542.32.00.71 | BGA | 64 | |||||||
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S71PL129JA0BAI9P0
Spansion
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Check for Price | No | Obsolete | 134.2177 Mbit | 16 | 8MX16 | 3 V | MEMORY CIRCUIT | PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16 | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | 3.1 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B64 | Not Qualified | e0 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 11.6 mm | 8 mm | SPANSION INC | TFBGA, | compliant | EAR99 | 8542.32.00.71 | BGA | 64 | |||||||
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S71PL129JA0BAI9P2
Cypress Semiconductor
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Check for Price | Active | CYPRESS SEMICONDUCTOR CORP | compliant | |||||||||||||||||||||||||||||||||||||||||||||
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S71PL129JA0BAI9P0
AMD
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Check for Price | Yes | Active | 70 ns | MEMORY CIRCUIT | FLASH+PSRAM | 5 µA | 70 µA | CMOS | INDUSTRIAL | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | FBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA64,10X12,32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||
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S71PL129JA0BAI9P0
Cypress Semiconductor
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Check for Price | Active | CYPRESS SEMICONDUCTOR CORP | compliant | |||||||||||||||||||||||||||||||||||||||||||||
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S71PL129JA0BAI9P3
Cypress Semiconductor
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Check for Price | Active | CYPRESS SEMICONDUCTOR CORP | compliant | |||||||||||||||||||||||||||||||||||||||||||||
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S71PL129JA0BAI9P2
Spansion
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Check for Price | No | Obsolete | 134.2177 Mbit | 16 | 8MX16 | 3 V | MEMORY CIRCUIT | PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16 | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | 3.1 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B64 | Not Qualified | e0 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 11.6 mm | 8 mm | SPANSION INC | TFBGA, | compliant | EAR99 | 8542.32.00.71 | BGA | 64 | |||||||
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S71PL129JA0BAI9P3
AMD
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Check for Price | Yes | Active | 70 ns | MEMORY CIRCUIT | FLASH+PSRAM | 5 µA | 70 µA | CMOS | INDUSTRIAL | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | FBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA64,10X12,32 | compliant | EAR99 | 8542.32.00.71 |