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S71NS256NC0BJWVN1
Spansion
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Check for Price | Yes | Yes | Transferred | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | MEMORY CIRCUIT | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B60 | Not Qualified | e2 | 3 | 85 °C | -25 °C | 260 | 40 | 60 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER NICKEL | BALL | 500 µm | BOTTOM | 1.2 mm | 11 mm | 10 mm | SPANSION INC | BGA | 10 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60 | 60 | unknown | EAR99 | 8542.32.00.71 | ||
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S71NS256NC0BJWVN1
Cypress Semiconductor
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Check for Price | Yes | Transferred | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | MEMORY CIRCUIT | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 1.95 V | 1.7 V | CMOS | OTHER | R-PBGA-B60 | Not Qualified | e2 | 3 | 85 °C | -25 °C | 260 | 40 | 60 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BALL | 500 µm | BOTTOM | 1.2 mm | 11 mm | 10 mm | CYPRESS SEMICONDUCTOR CORP | 10 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60 | compliant | EAR99 | 8542.32.00.71 |