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S70GL02GP11FACR22
Spansion
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Check for Price | Transferred | 2.1475 Gbit | 16 | 128MX16 | 3.3 V | FLASH | 8 | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | OTHER | R-PBGA-B64 | Not Qualified | 85 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | LBGA, | 64 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||
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S70GL02GP11FFIR12
Spansion
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Check for Price | Yes | Yes | Transferred | 4.295 Gbit | 16 | 128K | 256MX16 | 3.3 V | 110 ns | FLASH | 8 | NO | YES | NO | 1 | 2K | 256000000 | 268.4355 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 3.6 V | 3 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | LBGA, BGA64,8X8,40 | 64 | compliant | 3A991.B.1.A | 8542.32.00.71 | ||
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S70GL02GP11FFIR12
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 4.295 Gbit | 16 | 256MX16 | 3.3 V | 110 ns | FLASH | 8 | 1 | 256000000 | 268.4355 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-64 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||
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S70GL02GP13FAIV13
Spansion
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Check for Price | No | No | Obsolete | 4.295 Gbit | 16 | 128K | 256MX16 | 3 V | 130 ns | FLASH | 8 | NO | YES | NO | 1 | 2K | 256000000 | 268.4355 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PBGA-B64 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64 | 64 | not_compliant | EAR99 | 8542.32.00.51 | |||
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S70GL02GP11FACR22
Cypress Semiconductor
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Check for Price | No | Transferred | 2.1475 Gbit | 16 | 128MX16 | 3.3 V | FLASH | 8 | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | OTHER | R-PBGA-B64 | Not Qualified | 85 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | CYPRESS SEMICONDUCTOR CORP | FBGA-64 | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||||||
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S70GL02GP11FFCR20
Spansion
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Check for Price | Transferred | 2.1475 Gbit | 16 | 128MX16 | 3.3 V | FLASH | 8 | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | OTHER | R-PBGA-B64 | Not Qualified | 85 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | LBGA, | 64 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||
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S70GL02GP13FFIV22
Spansion
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Check for Price | Yes | Yes | Obsolete | 4.295 Gbit | 16 | 128K | 256MX16 | 3 V | 130 ns | FLASH | 8 | NO | YES | NO | 1 | 2K | 256000000 | 268.4355 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | LBGA, BGA64,8X8,40 | 64 | compliant | EAR99 | 8542.32.00.51 | ||
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S70GL02GP12FAI010
Spansion
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Check for Price | No | No | Obsolete | 4.295 Gbit | 16 | 128K | 256MX16 | 3 V | 120 ns | FLASH | 8 | NO | YES | NO | 1 | 2K | 256000000 | 268.4355 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PBGA-B64 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64 | 64 | not_compliant | EAR99 | 8542.32.00.51 | |||
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S70GL02GP11FAIR12
Cypress Semiconductor
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Check for Price | No | Obsolete | 4.295 Gbit | 16 | 256MX16 | 3.3 V | 110 ns | FLASH | 8 | 1 | 256000000 | 268.4355 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B64 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64 | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||
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S70GL02GP11FFCR10
Spansion
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Check for Price | Transferred | 2.1475 Gbit | 16 | 128MX16 | 3.3 V | FLASH | 8 | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | OTHER | R-PBGA-B64 | Not Qualified | 85 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | LBGA, | 64 | unknown | EAR99 | 8542.32.00.51 |