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Select Parts | Part Number |
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S34ML01G200BHI000
Cypress Semiconductor
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S34ML01G200BHI000
Spansion
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S34ML01G200BHI000
SkyHigh Memory Limited
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width |
Sector Size
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Organization |
Supply Voltage-Nom (Vsup)
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Access Time-Max
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Memory IC Type
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Command User Interface
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Common Flash Interface
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Data Polling
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Data Retention Time-Min
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Number of Functions |
Number of Sectors/Size
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Number of Words Code | Number of Words |
Operating Mode
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Page Size
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Parallel/Serial
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Programming Voltage
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Ready/Busy
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Standby Current-Max
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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Toggle Bit
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Type
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Write Cycle Time-Max (tWC)
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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ECCN Code
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HTS Code
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Samacsys Manufacturer
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Yes | Transferred | 1.0737 Gbit | 8 | 128K | 128MX8 | 3.3 V | 25 ns | FLASH | YES | NO | NO | 10 | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3.3 V | YES | 10 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | R-PBGA-B63 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 63 | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 9 mm | CYPRESS SEMICONDUCTOR CORP | BGA-63 | compliant | EAR99 | 8542.32.00.51 | |||||
Yes | Transferred | 1.0737 Gbit | 8 | 128K | 128MX8 | 3.3 V | 25 ns | FLASH | YES | NO | NO | 10 | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3.3 V | YES | 50 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | 25 ns | R-PBGA-B63 | Not Qualified | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 9 mm | SPANSION INC | BGA-63 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||
Yes | Contact Manufacturer | 1.0737 Gbit | 8 | 128K | 128MX8 | 3.3 V | 25 ns | FLASH | YES | YES | 10 | 1 | 1024 | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3 V | YES | 50 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | SLC NAND TYPE | 25 ns | R-PBGA-B63 | e1 | 3 | 85 °C | -40 °C | 260 | 63 | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 9 mm | SKYHIGH MEMORY LTD | BGA-63 | compliant | EAR99 | 8542.32.00.51 | SkyHigh Memory |
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S34ML01G200BHI000
Cypress Semiconductor
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$3.0073 Buy | Yes | Transferred | 1.0737 Gbit | 8 | 128K | 128MX8 | 3.3 V | 25 ns | FLASH | YES | NO | NO | 10 | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3.3 V | YES | 10 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | R-PBGA-B63 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 63 | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 9 mm | CYPRESS SEMICONDUCTOR CORP | BGA-63 | compliant | EAR99 | 8542.32.00.51 | ||||||
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S34ML01G200BHI000
Spansion
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Check for Price Buy | Yes | Transferred | 1.0737 Gbit | 8 | 128K | 128MX8 | 3.3 V | 25 ns | FLASH | YES | NO | NO | 10 | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3.3 V | YES | 50 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | 25 ns | R-PBGA-B63 | Not Qualified | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 9 mm | SPANSION INC | BGA-63 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | ||||||
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S34ML01G200BHI000
SkyHigh Memory Limited
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Check for Price Buy | Yes | Contact Manufacturer | 1.0737 Gbit | 8 | 128K | 128MX8 | 3.3 V | 25 ns | FLASH | YES | YES | 10 | 1 | 1024 | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3 V | YES | 50 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | SLC NAND TYPE | 25 ns | R-PBGA-B63 | e1 | 3 | 85 °C | -40 °C | 260 | 63 | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 9 mm | SKYHIGH MEMORY LTD | BGA-63 | compliant | EAR99 | 8542.32.00.51 | SkyHigh Memory |