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S29PL256N70GAWW02
Spansion
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Check for Price | Yes | Yes | Transferred | 268.4355 Mbit | 16 | 32K,128K | 16MX16 | 3 V | 70 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 8,126 | 16000000 | 16.7772 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 40 µA | 55 µA | 3.1 V | 2.7 V | CMOS | COMMERCIAL EXTENDED | YES | NOR TYPE | R-PBGA-B84 | Not Qualified | 85 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 84 | PLASTIC/EPOXY | VFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11.6 mm | 8 mm | SPANSION INC | BGA | VFBGA, BGA84,10X12,32 | 84 | compliant | EAR99 | 8542.32.00.51 | ||
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S29PL256N70GAWW02
Cypress Semiconductor
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Check for Price | Yes | Transferred | 268.4355 Mbit | 16 | 32K,128K | 16MX16 | 3 V | 70 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 8,126 | 16000000 | 16.7772 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 40 µA | 55 µA | 3.1 V | 2.7 V | CMOS | COMMERCIAL EXTENDED | YES | NOR TYPE | R-PBGA-B84 | Not Qualified | 85 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 84 | PLASTIC/EPOXY | VFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11.6 mm | 8 mm | CYPRESS SEMICONDUCTOR CORP | 8 X 11.60 MM, LEAD FREE, FBGA-84 | compliant | EAR99 | 8542.32.00.51 |