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Parametric » Memory » Flash Memories

Parametric results for: S29PL127J70BFW001 under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		S29PL127J70BFW001 AMD
		S29PL127J70BFW001 Cypress Semiconductor
		S29PL127J70BFW001 Spansion

				Most Relevant						Technical																							Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

,

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

16

4K,32K

8MX16

3 V

70 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

YES

YES

YES

1

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B80

Not Qualified

e1

3

85 °C

-25 °C

260

40

80

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

VFBGA, BGA80,8X12,32

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Yes

Transferred

134.2177 Mbit

16

4K,32K

8MX16

3 V

70 ns

FLASH

BOTTOM/TOP

YES

YES

YES

1

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B80

Not Qualified

e1

3

85 °C

-25 °C

260

40

80

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

SPANSION INC

11 X 8 MM, LEAD FREE, FBGA-80

unknown

EAR99

8542.32.00.51

BGA

80

Compare

S29PL127J70BFW001

AMD

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

,

unknown

EAR99

8542.32.00.51

S29PL127J70BFW001

Cypress Semiconductor

Check for Price

Yes

Transferred

134.2177 Mbit

16

4K,32K

8MX16

3 V

70 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

YES

YES

YES

1

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B80

Not Qualified

e1

3

85 °C

-25 °C

260

40

80

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

VFBGA, BGA80,8X12,32

compliant

EAR99

8542.32.00.51

S29PL127J70BFW001

Spansion

Check for Price

Yes

Yes

Transferred

134.2177 Mbit

16

4K,32K

8MX16

3 V

70 ns

FLASH

BOTTOM/TOP

YES

YES

YES

1

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B80

Not Qualified

e1

3

85 °C

-25 °C

260

40

80

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

SPANSION INC

11 X 8 MM, LEAD FREE, FBGA-80

unknown

EAR99

8542.32.00.51

BGA

80