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S29PL127J60TAI002
Spansion
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Check for Price | Yes | Transferred | 134.2177 Mbit | 16 | 4K,32K | 8MX16 | 60 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 16,254 | 8000000 | 8.3886 M | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | ||||||||||||
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S29PL127J60TAI002
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 134.2177 Mbit | 16 | 4K,32K | 8MX16 | 3 V | 60 ns | FLASH | TOP AND BOTTOM BOOT BLOCK | BOTTOM/TOP | YES | YES | YES | 1 | 16,254 | 8000000 | 8.3886 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B80 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | VFBGA | TSSOP56,.8,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 8 mm | CYPRESS SEMICONDUCTOR CORP | compliant | EAR99 | 8542.32.00.51 | FBGA-80 |