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S29PL127J60BFI000
Cypress Semiconductor
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$8.8453 | Yes | Obsolete | 134.2177 Mbit | 16 | 4K,32K | 8MX16 | 3 V | 60 ns | FLASH | TOP AND BOTTOM BOOT BLOCK | BOTTOM/TOP | YES | YES | YES | 1 | 16,254 | 8000000 | 8.3886 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B80 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 80 | PLASTIC/EPOXY | VFBGA | BGA80,8X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 8 mm | CYPRESS SEMICONDUCTOR CORP | FBGA-80 | compliant | EAR99 | 8542.32.00.51 | |||||
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S29PL127J60BFI000
AMD
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Check for Price | Transferred | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S29PL127J60BFI003
Spansion
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Check for Price | Yes | Yes | Transferred | 134.2177 Mbit | 16 | 4K,32K | 8MX16 | 3 V | 60 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 16,254 | 8000000 | 8.3886 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B80 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 80 | PLASTIC/EPOXY | VFBGA | BGA80,8X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 8 mm | SPANSION INC | 11 X 8 MM, LEAD FREE, FBGA-80 | unknown | EAR99 | 8542.32.00.51 | BGA | 80 | |||
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S29PL127J60BFI001
Cypress Semiconductor
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Check for Price | Yes | Transferred | 134.2177 Mbit | 16 | 4K,32K | 8MX16 | 3 V | 60 ns | FLASH | TOP AND BOTTOM BOOT BLOCK | BOTTOM/TOP | YES | YES | YES | 1 | 16,254 | 8000000 | 8.3886 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B80 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 80 | PLASTIC/EPOXY | VFBGA | BGA80,8X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 8 mm | CYPRESS SEMICONDUCTOR CORP | VFBGA, BGA80,8X12,32 | compliant | EAR99 | 8542.32.00.51 | |||||
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S29PL127J60BFI001
AMD
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Check for Price | Transferred | ADVANCED MICRO DEVICES INC | , | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S29PL127J60BFI002
AMD
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Check for Price | Transferred | ADVANCED MICRO DEVICES INC | , | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S29PL127J60BFI001
Spansion
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Check for Price | Yes | Yes | Transferred | 134.2177 Mbit | 16 | 4K,32K | 8MX16 | 3 V | 60 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 16,254 | 8000000 | 8.3886 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B80 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 80 | PLASTIC/EPOXY | VFBGA | BGA80,8X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 8 mm | SPANSION INC | 11 X 8 MM, LEAD FREE, FBGA-80 | unknown | EAR99 | 8542.32.00.51 | BGA | 80 | |||
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S29PL127J60BFI003
AMD
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Check for Price | Transferred | ADVANCED MICRO DEVICES INC | , | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S29PL127J60BFI00
AMD
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Check for Price | Transferred | ADVANCED MICRO DEVICES INC | , | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S29PL127J60BFI002
Cypress Semiconductor
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Check for Price | Yes | Transferred | 134.2177 Mbit | 16 | 4K,32K | 8MX16 | 3 V | 60 ns | FLASH | TOP AND BOTTOM BOOT BLOCK | BOTTOM/TOP | YES | YES | YES | 1 | 16,254 | 8000000 | 8.3886 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B80 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 80 | PLASTIC/EPOXY | VFBGA | BGA80,8X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 8 mm | CYPRESS SEMICONDUCTOR CORP | VFBGA, BGA80,8X12,32 | compliant | EAR99 | 8542.32.00.51 |