Findchips: Parametric Search Results for S29PL127J55BFI02

Parametric results for: S29PL127J55BFI02 under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		S29PL127J55BFI021 Spansion
		S29PL127J55BFI02 Cypress Semiconductor
		S29PL127J55BFI020 Cypress Semiconductor
		S29PL127J55BFI022 Spansion
		S29PL127J55BFI021 AMD
		S29PL127J55BFI023 Spansion
		S29PL127J55BFI02 AMD
		S29PL127J55BFI021 Cypress Semiconductor
		S29PL127J55BFI020 AMD
		S29PL127J55BFI02 Spansion

			Most Relevant							Technical																						Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Power Supplies	Access Time-Max	Memory IC Type	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, LEAD FREE, FBGA-64

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

8 words

PARALLEL

YES

5 µA

70 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Active

134.2177 Mbit

4K,32K

8MX16

3/3.3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

8 words

PARALLEL

YES

5 µA

70 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, LEAD FREE, FBGA-64

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, LEAD FREE, FBGA-64

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Active

134.2177 Mbit

4K,32K

8MX16

3/3.3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

8 words

PARALLEL

YES

5 µA

70 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

1.8 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

SYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

SPANSION INC

BGA

VFBGA, BGA64,10X12,32

compliant

EAR99

8542.32.00.51

1 2 Next

Compare

S29PL127J55BFI021

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, LEAD FREE, FBGA-64

unknown

EAR99

8542.32.00.51

S29PL127J55BFI02

Cypress Semiconductor

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

8 words

PARALLEL

YES

5 µA

70 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

EAR99

8542.32.00.51

S29PL127J55BFI020

Cypress Semiconductor

Check for Price

Yes

Active

134.2177 Mbit

4K,32K

8MX16

3/3.3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

8 words

PARALLEL

YES

5 µA

70 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

S29PL127J55BFI022

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, LEAD FREE, FBGA-64

unknown

EAR99

8542.32.00.51

S29PL127J55BFI021

AMD

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

S29PL127J55BFI023

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, LEAD FREE, FBGA-64

unknown

EAR99

8542.32.00.51

S29PL127J55BFI02

AMD

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

S29PL127J55BFI021

Cypress Semiconductor

Check for Price

Yes

Active

134.2177 Mbit

4K,32K

8MX16

3/3.3 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

8 words

PARALLEL

YES

5 µA

70 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

S29PL127J55BFI020

AMD

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

S29PL127J55BFI02

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

1.8 V

55 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

SYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

SPANSION INC

BGA

VFBGA, BGA64,10X12,32

compliant

EAR99

8542.32.00.51

1 2 Next