Parametric results for: S29PL032J70BFW150 under Flash Memories

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Manufacturer Part Number: s29pl032j70bfw150
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S29PL032J70BFW150
Spansion
Check for Price Yes Yes Transferred 33.5544 Mbit 16 4K,32K 2MX16 3 V 70 ns FLASH TOP AND BOTTOM BOOT BLOCK BOTTOM/TOP YES YES YES 1 16,62 2000000 2.0972 M ASYNCHRONOUS 8 words PARALLEL 3 V YES 5 µA 70 µA 3.6 V 2.7 V CMOS OTHER YES NOR TYPE R-PBGA-B56 Not Qualified e1 3 85 °C -25 °C 260 40 56 PLASTIC/EPOXY VFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1 mm 9 mm 7 mm SPANSION INC BGA 7 X 9 MM, LEAD FREE, FBGA-56 56 unknown EAR99 8542.32.00.51
S29PL032J70BFW150
AMD
Check for Price Transferred ADVANCED MICRO DEVICES INC , unknown EAR99 8542.32.00.51
S29PL032J70BFW150
Cypress Semiconductor
Check for Price Yes Transferred 33.5544 Mbit 16 4K,32K 2MX16 3 V 70 ns FLASH TOP AND BOTTOM BOOT BLOCK BOTTOM/TOP YES YES YES 1 16,62 2000000 2.0972 M ASYNCHRONOUS 8 words PARALLEL 3 V YES 5 µA 70 µA 3.6 V 2.7 V CMOS OTHER YES NOR TYPE R-PBGA-B56 Not Qualified e1 3 85 °C -25 °C 260 40 56 PLASTIC/EPOXY VFBGA BGA56,8X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 1 mm 9 mm 7 mm CYPRESS SEMICONDUCTOR CORP VFBGA, BGA56,8X8,32 compliant EAR99 8542.32.00.51