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S29PL032J55BAW153
Spansion
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Check for Price | No | No | Transferred | 33.5544 Mbit | 16 | 4K,32K | 2MX16 | 3 V | 55 ns | FLASH | TOP AND BOTTOM BOOT BLOCK | BOTTOM/TOP | YES | YES | YES | 1 | 16,62 | 2000000 | 2.0972 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | OTHER | YES | NOR TYPE | R-PBGA-B56 | Not Qualified | e0 | 3 | 85 °C | -25 °C | 260 | 56 | PLASTIC/EPOXY | VFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1 mm | 9 mm | 7 mm | SPANSION INC | BGA | 7 X 9 MM, LEAD FREE COMPLIANT, FBGA-56 | 56 | not_compliant | EAR99 | 8542.32.00.51 | ||
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S29PL032J55BAW153
Cypress Semiconductor
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 4K,32K | 2MX16 | 3 V | 55 ns | FLASH | TOP AND BOTTOM BOOT BLOCK | BOTTOM/TOP | YES | YES | YES | 1 | 16,62 | 2000000 | 2.0972 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | OTHER | YES | NOR TYPE | R-PBGA-B56 | Not Qualified | e0 | 3 | 85 °C | -25 °C | 260 | 56 | PLASTIC/EPOXY | VFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1 mm | 9 mm | 7 mm | CYPRESS SEMICONDUCTOR CORP | FBGA-56 | compliant | EAR99 | 8542.32.00.51 | |||||
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S29PL032J55BAW153
AMD
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Check for Price | Transferred | ADVANCED MICRO DEVICES INC | , | unknown | EAR99 | 8542.32.00.51 |