Findchips: Parametric Search Results for S29NS032J0PBAW000


Select Parts		Part Number

		S29NS032J0PBFW00 Cypress Semiconductor
		S29NS032J0PBJW000 Spansion
		S29NS032J0PBJW002 Spansion
		S29NS032J0PBFW00 Spansion
		S29NS032J0PBFW002 Spansion
		S29NS032J0PBFW003 Spansion
		S29NS032J0PBFW00 AMD
		S29NS032J0PBJW003 Spansion
		S29NS032J0PBFW000 Spansion

				Most Relevant						Technical																							Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	Write Cycle Time-Max (tWC)	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Package Description	Pin Count

Check for Price

Yes

Transferred

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

TOP

YES

4,63

2000000

2.0972 M

PARALLEL

YES

40 µA

60 µA

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

FBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

Check for Price

Yes

Transferred

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

TOP

YES

4,63

2000000

2.0972 M

PARALLEL

YES

40 µA

60 µA

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

FBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

SPANSION INC

unknown

EAR99

8542.32.00.51

FBGA, BGA44,8X14,20

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

Compare

S29NS032J0PBFW00

Cypress Semiconductor

Check for Price

Yes

Transferred

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

TOP

YES

4,63

2000000

2.0972 M

PARALLEL

YES

40 µA

60 µA

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

FBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

EAR99

8542.32.00.51

S29NS032J0PBJW000

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

S29NS032J0PBJW002

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

S29NS032J0PBFW00

Spansion

Check for Price

Yes

Transferred

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

TOP

YES

4,63

2000000

2.0972 M

PARALLEL

YES

40 µA

60 µA

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

FBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

SPANSION INC

unknown

EAR99

8542.32.00.51

FBGA, BGA44,8X14,20

S29NS032J0PBFW002

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

S29NS032J0PBFW003

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

S29NS032J0PBFW00

AMD

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

S29NS032J0PBJW003

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

S29NS032J0PBFW000

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

8K,32K

2MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

unknown

EAR99

8542.32.00.51

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

Parametric results for: S29NS032J0PBAW000 under Flash Memories