Findchips: Parametric Search Results for S29NS016JPLBFW002

Parametric results for: S29NS016JPLBFW002 under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		S29NS016J0LBFW003 Spansion
		S29NS016J0LBFW00 Spansion
		S29NS016J0PBFW002 Spansion
		S29NS016J0PBFW000 Spansion
		S29NS016J0PBJW002 Spansion
		S29NS016J0LBFW002 Spansion
		S29NS016J0LBFW000 Spansion
		S29NS016J0PBFW003 Spansion
		S29NS016J0LBJW002 Spansion
		S29NS016J0PBFW00 AMD

			Most Relevant						Technical																							Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	Write Cycle Time-Max (tWC)	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

80 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

16.7772 Mbit

8K,32K

1MX16

1.8 V

70 ns

FLASH

TOP

YES

4,31

1000000

1.0486 M

PARALLEL

YES

40 µA

60 µA

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

FBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

SPANSION INC

FBGA, BGA44,8X14,20

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

80 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

80 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

80 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

1 2 Next

Compare

S29NS016J0LBFW003

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

80 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

S29NS016J0LBFW00

Spansion

Check for Price

Yes

Transferred

16.7772 Mbit

8K,32K

1MX16

1.8 V

70 ns

FLASH

TOP

YES

4,31

1000000

1.0486 M

PARALLEL

YES

40 µA

60 µA

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

FBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

SPANSION INC

FBGA, BGA44,8X14,20

unknown

EAR99

8542.32.00.51

S29NS016J0PBFW002

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

S29NS016J0PBFW000

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

S29NS016J0PBJW002

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

S29NS016J0LBFW002

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

80 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

S29NS016J0LBFW000

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

80 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

S29NS016J0PBFW003

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

65 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

45 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

S29NS016J0LBJW002

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,32K

1MX16

1.8 V

70 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

TOP

YES

4,31

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.7 V

CMOS

OTHER

YES

NOR TYPE

80 ms

R-PBGA-B44

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

VFBGA

BGA44,8X14,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

7.7 mm

6.2 mm

SPANSION INC

BGA

7.70 X 6.20 MM, LEAD FREE, FBGA-44

unknown

EAR99

8542.32.00.51

S29NS016J0PBFW00

AMD

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

1 2 Next