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IS29GL256S90FHI013
Integrated Silicon Solution Inc
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Check for Price | Active | 268.4355 Mbit | 8 | 32MX8 | 3 V | 90 ns | FLASH | BOTTOM/TOP | 1 | 32000000 | 33.5544 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B64 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | INTEGRATED SILICON SOLUTION INC | LBGA, | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
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S29GL256S90FHI013
Cypress Semiconductor
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Check for Price | Yes | Transferred | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 3-STATE | 16 words | PARALLEL | 3 V | YES | 100 µA | 80 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | CYPRESS SEMICONDUCTOR CORP | FBGA-64 | compliant | 3A991.B.1.A | 8542.32.00.51 | ||||||
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S29GL256S90FHI013
Spansion
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Check for Price | Yes | Yes | Transferred | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | EEPROM CARD | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 16 words | PARALLEL | 2.7 V | YES | 100 µA | 80 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | FBGA-64 | compliant | 3A991.B.1.A | 8542.32.00.51 | |||||||||
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S29GL256S90FHI013
Infineon Technologies AG
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Check for Price | Yes | Active | 268.4355 Mbit | 16 | 64K | 16MX16 | 3 V | 90 ns | FLASH | YES | YES | YES | 20 | 100000 Write/Erase Cycles | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 3-STATE | 16 words | PARALLEL | 3 V | YES | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | YES | NOR TYPE | R-PBGA-B64 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | INFINEON TECHNOLOGIES AG | compliant | Infineon |