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S29GL256P11TFIR23
Spansion
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S29GL256P11TFIR23
Cypress Semiconductor
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Access Time-Max
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Memory IC Type
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Boot Block
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Number of Functions | Number of Words Code | Number of Words |
Operating Mode
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Output Characteristics
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Parallel/Serial
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Programming Voltage
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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Type
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Number of Terminals
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Package Body Material
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Package Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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ECCN Code
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HTS Code
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Yes | Yes | Transferred | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 110 ns | FLASH | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | HTSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | EAR99 | 8542.32.00.51 | |||
Yes | Transferred | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 110 ns | FLASH | BOTTOM/TOP | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | 110 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | HTSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | HTSSOP, | compliant | EAR99 | 8542.32.00.51 |
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S29GL256P11TFIR23
Spansion
|
Check for Price | Yes | Yes | Transferred | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 110 ns | FLASH | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | HTSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | EAR99 | 8542.32.00.51 | ||||
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S29GL256P11TFIR23
Cypress Semiconductor
|
Check for Price | Yes | Transferred | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 110 ns | FLASH | BOTTOM/TOP | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | 110 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | HTSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | HTSSOP, | compliant | EAR99 | 8542.32.00.51 |