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S29GL032M10FFIR30
AMD
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Check for Price | Yes | Transferred | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 100 ns | FLASH | 8 | TOP | YES | YES | YES | 8,63 | 2000000 | 2.0972 M | 4/8 words | PARALLEL | YES | 5 µA | 60 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | S-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||
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S29GL032M10FFIR30
Spansion
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Check for Price | Yes | Yes | Obsolete | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 3.3 V | 100 ns | FLASH | TOP BOOT BLOCK | 8 | TOP | YES | YES | YES | 1 | 8,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | 4/8 words | PARALLEL | 3 V | YES | 5 µA | 60 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | BGA | 13 X 11 MM, LEAD FREE, FORTIFIED, BGA-64 | 64 |