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S29AL008D90BFN023
Spansion
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Check for Price | Yes | Obsolete | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3.3 V | 90 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 35 µA | 3.6 V | 2.7 V | CMOS | AUTOMOTIVE | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | 8.15 X 6.15 MM, LEAD FREE, FBGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 | ||
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S29AL008D90BFN023
AMD
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Check for Price | Yes | Transferred | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 90 ns | FLASH | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1,2,1,15 | 512000 | 524.288 k | PARALLEL | YES | 5 µA | 35 µA | CMOS | AUTOMOTIVE | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 125 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||||
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S29AL008D90BFN023
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 8.3886 Mbit | 16 | 512KX16 | 3.3 V | 90 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | 35 µA | 3.6 V | 2.7 V | CMOS | AUTOMOTIVE | NOR TYPE | R-PBGA-B48 | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | CYPRESS SEMICONDUCTOR CORP | 8.15 X 6.15 MM, LEAD FREE, FBGA-48 | compliant | EAR99 | 8542.32.00.51 |