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S29AL004D90TFN023
AMD
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Check for Price | Yes | Transferred | 4.1943 Mbit | 16 | 16K,8K,32K,64K | 256KX16 | 90 ns | FLASH | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1,2,1,7 | 256000 | 262.144 k | PARALLEL | YES | 5 µA | 35 µA | CMOS | AUTOMOTIVE | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | 125 °C | -40 °C | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | ADVANCED MICRO DEVICES INC | TSSOP, TSSOP48,.8,20 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||
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S29AL004D90TFN023
Spansion
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Check for Price | Yes | Obsolete | 4.1943 Mbit | 16 | 16K,8K,32K,64K | 256KX16 | 3 V | 90 ns | FLASH | ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,7 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 35 µA | 3.6 V | 2.7 V | CMOS | AUTOMOTIVE | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SPANSION INC | TSSOP, TSSOP48,.8,20 | compliant | EAR99 | 8542.32.00.51 | TSOP1 | 48 | ||
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S29AL004D90TFN023
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 4.1943 Mbit | 16 | 256KX16 | 3 V | 90 ns | FLASH | ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK | 8 | BOTTOM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | AUTOMOTIVE | NOR TYPE | R-PDSO-G48 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | CYPRESS SEMICONDUCTOR CORP | TSOP-48 | compliant | EAR99 | 8542.32.00.51 |