Findchips: Parametric Search Results for S29AL004D55BAI023


Select Parts		Part Number

		S29AL004D55BAI023 AMD
		S29AL004D55BAI023 Spansion
		S29AL004D55BAI023 Cypress Semiconductor

			Most Relevant						Technical																							Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Data Polling	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Package Description	Pin Count

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Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

55 ns

FLASH

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

PARALLEL

YES

5 µA

35 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

55 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

not_compliant

EAR99

8542.32.00.51

BGA

8.15 X 6.15 MM, FBGA-48

Check for Price

Obsolete

4.1943 Mbit

256KX16

3 V

55 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

compliant

EAR99

8542.32.00.51

FBGA-48

Compare

S29AL004D55BAI023

AMD

Check for Price

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

55 ns

FLASH

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

PARALLEL

YES

5 µA

35 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

S29AL004D55BAI023

Spansion

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

55 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

not_compliant

EAR99

8542.32.00.51

BGA

8.15 X 6.15 MM, FBGA-48

S29AL004D55BAI023

Cypress Semiconductor

Check for Price

Obsolete

4.1943 Mbit

256KX16

3 V

55 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

compliant

EAR99

8542.32.00.51

FBGA-48

Parametric results for: S29AL004D55BAI023 under Flash Memories