Parametric results for: S25FL256*%20SPANSION under Flash Memories

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Manufacturer Part Number: s25fl256
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S25FL256LDPNFB010
Infineon Technologies AG
$1.0000 Yes Active 268.4355 Mbit 8 32MX8 3 V 66 MHz FLASH 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 60 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N8 e3 3 105 °C -40 °C NOT SPECIFIED AEC-Q100 NOT SPECIFIED 8 PLASTIC/EPOXY HVQCCN SOLCC8,.25 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) NO LEAD 1.27 mm DUAL 800 µm 6 mm 5 mm INFINEON TECHNOLOGIES AG WSON-8 compliant
S25FL256LDPNFB013
Infineon Technologies AG
$1.0000 Yes Active 268.4355 Mbit 8 32MX8 3 V 66 MHz FLASH 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 60 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N8 e3 3 105 °C -40 °C NOT SPECIFIED AEC-Q100 NOT SPECIFIED 8 PLASTIC/EPOXY HVQCCN SOLCC8,.25 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) NO LEAD 1.27 mm DUAL 800 µm 6 mm 5 mm INFINEON TECHNOLOGIES AG WSON-8 compliant
S25FL256SAGBHI210
Spansion
$2.1600 Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC FBGA-24 compliant BGA 24 3A991.B.1.A 8542.32.00.51
S25FL256SAGMFI011
Spansion
$2.5100 Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH IT ALSO CONFIGURED AS 256M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC SOIC-16 compliant SOIC 16 3A991.B.1.A 8542.32.00.51 Spansion
S25FL256SAGMFI000
Spansion
$2.5100 Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH IT ALSO CONFIGURED AS 256M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC SOIC-16 compliant SOIC 16 3A991.B.1.A 8542.32.00.51 Spansion
S25FL256SAGMFIG01
Spansion
$2.5100 Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC SOIC-16 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S25FL256SAGBHIC00
Spansion
$2.5300 Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC FBGA-24 compliant BGA 24 3A991.B.1.A 8542.32.00.51 Spansion
S25FL256SAGMFIR01
Spansion
$2.6488 Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH IT ALSO CONFIGURED AS 256M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC SOIC-16 compliant SOIC 16 3A991.B.1.A 8542.32.00.51 Spansion
S25FL256SAGBHI200
Spansion
$2.6765 Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC FBGA-24 compliant BGA 24 3A991.B.1.A 8542.32.00.51 Spansion
S25FL256SAGNFI001
Spansion
$2.6765 Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 85 °C -40 °C 260 40 8 PLASTIC/EPOXY HVSON SOLCC8,.3 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 8 mm 6 mm SPANSION INC WSON-8 compliant SON 8 3A991.B.1.A 8542.32.00.51 Spansion