Findchips: Parametric Search Results for S25FL129P0XBHV200


Select Parts		Part Number

		S25FL129P0XBHV200 Cypress Semiconductor
		S25FL129P0XBHV200 Spansion

				Most Relevant					Technical																		Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Clock Frequency-Max (fCLK)	Memory IC Type	Data Retention Time-Min	Endurance	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Serial Bus Type	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Type	Write Protection	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Obsolete

134.2177 Mbit

16MX8

3 V

104 MHz

FLASH

100000 Write/Erase Cycles

16000000

16.7772 M

SYNCHRONOUS

SERIAL

3 V

SPI

10 µA

38 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PBGA-B24

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

MATTE TIN

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

CYPRESS SEMICONDUCTOR CORP

6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

16MX8

3 V

104 MHz

FLASH

100000 Write/Erase Cycles

16000000

16.7772 M

SYNCHRONOUS

SERIAL

3 V

SPI

10 µA

38 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PBGA-B24

Not Qualified

105 °C

-40 °C

260

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Matte Tin (Sn)

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24

compliant

3A991.B.1.A

8542.32.00.51

BGA

Compare

S25FL129P0XBHV200

Cypress Semiconductor

Check for Price

Yes

Obsolete

134.2177 Mbit

16MX8

3 V

104 MHz

FLASH

100000 Write/Erase Cycles

16000000

16.7772 M

SYNCHRONOUS

SERIAL

3 V

SPI

10 µA

38 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PBGA-B24

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

MATTE TIN

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

CYPRESS SEMICONDUCTOR CORP

6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24

compliant

EAR99

8542.32.00.51

S25FL129P0XBHV200

Spansion

Check for Price

Yes

Transferred

134.2177 Mbit

16MX8

3 V

104 MHz

FLASH

100000 Write/Erase Cycles

16000000

16.7772 M

SYNCHRONOUS

SERIAL

3 V

SPI

10 µA

38 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PBGA-B24

Not Qualified

105 °C

-40 °C

260

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Matte Tin (Sn)

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24

compliant

3A991.B.1.A

8542.32.00.51

BGA

Parametric results for: S25FL129P0XBHV200 under Flash Memories