Parametric results for: QDRII under SRAMs

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Memory IC Type: QDR II PLUS SRAM,QDR II SRAM,QDR III SRAM
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CY7C1312KV18-250BZI
Infineon Technologies AG
$16.3691 No Active 18.8744 Mbit 18 1MX18 1.8 V 450 ps 250 MHz QDR II SRAM PIPELINED ARCHITECTURE SEPARATE 1 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 250 mA 1.7 V 560 µA 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG compliant
CY7C1514KV18-250BZI
Infineon Technologies AG
$118.4545 No Active 75.4975 Mbit 36 2MX36 1.8 V 450 ps 250 MHz QDR II SRAM PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V SEPARATE 1 2000000 2.0972 M SYNCHRONOUS 3-STATE PARALLEL 1.7 V 790 µA 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm INFINEON TECHNOLOGIES AG compliant Infineon
GS81302Q37GE-318
GSI Technology
$145.4665 Yes Not Recommended 150.9949 Mbit 36 4MX36 1.8 V 450 ps QDR II PLUS SRAM PIPELINED ARCHITECTURE 1 4000000 4.1943 M SYNCHRONOUS PARALLEL 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 e1 3 70 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.5 mm 17 mm 15 mm GSI TECHNOLOGY compliant GSI TECHNOLOGY BGA LBGA, 165 3A991.B.2.B 8542.32.00.41
GS81302DT38GE-500I
GSI Technology
$149.4021 Yes Yes Not Recommended 150.9949 Mbit 36 4MX36 1.8 V 450 ps QDR II SRAM PIPELINED ARCHITECTURE 1 4000000 4.1943 M SYNCHRONOUS PARALLEL 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.5 mm 17 mm 15 mm GSI TECHNOLOGY compliant GSI TECHNOLOGY BGA LBGA, 165 3A991.B.2.B 8542.32.00.41
CY7C1612KV18-250BZXC
Infineon Technologies AG
$278.7502 Yes Active 150.9949 Mbit 18 8MX18 1.8 V 450 ps 250 MHz QDR II SRAM PIPELINED ARCHITECTURE SEPARATE 1 1 8000000 8.3886 M SYNCHRONOUS 3-STATE NO PARALLEL 370 mA 1.7 V 800 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 NOT SPECIFIED 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 17 mm 15 mm INFINEON TECHNOLOGIES AG compliant FBGA-165
CY7C1612KV18-250BZXC
Cypress Semiconductor
$308.0064 Yes Transferred 150.9949 Mbit 18 8MX18 1.8 V 450 ps 250 MHz QDR II SRAM PIPELINED ARCHITECTURE SEPARATE 1 1 8000000 8.3886 M SYNCHRONOUS 3-STATE NO PARALLEL 370 mA 1.7 V 800 µA 1.9 V 1.7 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 17 mm 15 mm CYPRESS SEMICONDUCTOR CORP compliant BGA FBGA-165 165 3A991.B.2.A 8542.32.00.41
CY7C2644KV18-300BZXI
Infineon Technologies AG
$320.3315 Yes Active 150.9949 Mbit 36 4MX36 1.8 V QDR II PLUS SRAM PIPELINED ARCHITECTURE 1 4000000 4.1943 M SYNCHRONOUS PARALLEL 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 e1 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 17 mm 15 mm INFINEON TECHNOLOGIES AG compliant Infineon 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
CY7C2665KV18-550BZI
Infineon Technologies AG
$657.3463 No Active 150.9949 Mbit 36 4MX36 1.8 V 450 ps 550 MHz QDR II PLUS SRAM PIPELINED ARCHITECTURE SEPARATE 1 1 4000000 4.1943 M SYNCHRONOUS 3-STATE NO PARALLEL 500 mA 1.7 V 1.52 mA 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 17 mm 15 mm INFINEON TECHNOLOGIES AG compliant Infineon FBGA-165
CY7C2665KV18-550BZI
Cypress Semiconductor
$726.3601 No Transferred 150.9949 Mbit 36 4MX36 1.8 V 450 ps 550 MHz QDR II PLUS SRAM PIPELINED ARCHITECTURE SEPARATE 1 1 4000000 4.1943 M SYNCHRONOUS 3-STATE NO PARALLEL 500 mA 1.7 V 1.52 mA 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 17 mm 15 mm CYPRESS SEMICONDUCTOR CORP compliant BGA FBGA-165 165 3A991.B.2.A 8542.32.00.41
GS81302Q07GE-318IT
GSI Technology
Check for Price Active 134.2177 Mbit 8 16MX8 1.8 V 450 ps QDR II PLUS SRAM PIPELINED ARCHITECTURE 1 16000000 16.7772 M SYNCHRONOUS PARALLEL 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 e1 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.5 mm 17 mm 15 mm GSI TECHNOLOGY compliant BGA LBGA, 165 3A991.B.2.A 8542.32.00.41