Parametric results for: PCD3320C under Telephone Circuits
Filter Your Search
1 - 5 of 5 results
|
Select parts from the table below to compare.
Compare
Compare
|
PCD3320CD
NXP Semiconductors
|
Check for Price | Obsolete | 3 V | TELEPHONE DIALER CIRCUIT | SELECTABLE MAKE/BREAK RATIO 1:2 | 1:1.5 | 1 | 400 µA | OTHER | R-GDIP-T18 | Not Qualified | 70 °C | -25 °C | 18 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 5.08 mm | NXP SEMICONDUCTORS | DIP | DIP, | 18 | unknown | 8542.39.00.01 | ||||||||
|
|
PCD3320CD
Philips Semiconductors
|
Check for Price | No | Transferred | CMOS | 400 µA | OTHER | R-XDIP-T18 | e0 | Not Qualified | 70 °C | -25 °C | 18 | CERAMIC | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | PHILIPS SEMICONDUCTORS | DIP, DIP18,.3 | unknown | 8542.39.00.01 | ||||||||||||
|
|
PCD3320CP
NXP Semiconductors
|
Check for Price | Obsolete | 3 V | TELEPHONE DIALER CIRCUIT | SELECTABLE MAKE/BREAK RATIO 1:2 | 1:1.5 | 1 | 400 µA | OTHER | R-PDIP-T18 | Not Qualified | 70 °C | -25 °C | 18 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 21.6 mm | 4.7 mm | NXP SEMICONDUCTORS | DIP, | unknown | 8542.39.00.01 | |||||||||
|
|
PCD3320CP
Philips Semiconductors
|
Check for Price | No | Transferred | CMOS | 400 µA | OTHER | R-PDIP-T18 | e0 | Not Qualified | 70 °C | -25 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | PHILIPS SEMICONDUCTORS | DIP, DIP18,.3 | unknown | 8542.39.00.01 | ||||||||||||
|
|
PCD3320CD-T
NXP Semiconductors
|
Check for Price | Obsolete | 3 V | TELEPHONE DIALER CIRCUIT | SELECTABLE MAKE/BREAK RATIO 1:2 | 1:1.5 | 1 | 400 µA | OTHER | R-GDIP-T18 | Not Qualified | 70 °C | -25 °C | 18 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 5.08 mm | NXP SEMICONDUCTORS | DIP | DIP, | 18 | unknown | 8542.39.00.01 |