Findchips: Parametric Search Results for NX25P20-VNI

Parametric results for: NX25P20-VNI under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		NX25P20-VNI-G Winbond Electronics Corp
		NX25P20-VNI Nexflash Technologies Inc
		NX25P20-VNI-G Nexflash Technologies Inc
		NX25P20-VNI Winbond Electronics Corp
		NX25P20-VNI-T Nexflash Technologies Inc
		NX25P20-VNI-T Winbond Electronics Corp
		NX25P20-VNI-C Winbond Electronics Corp
		NX25P20-VNI-C Nexflash Technologies Inc
		NX25P20-VNI-GT Winbond Electronics Corp
		NX25P20-VNI-GT Nexflash Technologies Inc

				Most Relevant					Technical																			Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Clock Frequency-Max (fCLK)	Memory IC Type	Data Retention Time-Min	Endurance	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Serial Bus Type	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Type	Write Protection	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

2.0972 Mbit

256KX8

3 V

25 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

25 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

MATTE TIN

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

WINBOND ELECTRONICS CORP

SOIC

0.150 INCH, GREEN, SOIC-8

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

2.0972 Mbit

256KX8

3 V

40 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

25 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

NEXFLASH TECHNOLOGIES INC

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

2.0972 Mbit

256KX8

3 V

40 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

25 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

NEXFLASH TECHNOLOGIES INC

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

2.0972 Mbit

256KX8

3 V

25 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

25 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

WINBOND ELECTRONICS CORP

SOIC

0.150 INCH, SOIC-8

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

NEXFLASH TECHNOLOGIES INC

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

2.0972 Mbit

256KX8

3 V

40 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

WINBOND ELECTRONICS CORP

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

2.0972 Mbit

256KX8

3 V

40 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

WINBOND ELECTRONICS CORP

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

NEXFLASH TECHNOLOGIES INC

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

2.0972 Mbit

256KX8

3 V

40 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

WINBOND ELECTRONICS CORP

SOP, SOP8,.25

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

NEXFLASH TECHNOLOGIES INC

unknown

EAR99

8542.32.00.51

Compare

NX25P20-VNI-G

Winbond Electronics Corp

Check for Price

Yes

Obsolete

2.0972 Mbit

256KX8

3 V

25 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

25 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

MATTE TIN

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

WINBOND ELECTRONICS CORP

SOIC

0.150 INCH, GREEN, SOIC-8

compliant

EAR99

8542.32.00.51

NX25P20-VNI

Nexflash Technologies Inc

Check for Price

Transferred

2.0972 Mbit

256KX8

3 V

40 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

25 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

NEXFLASH TECHNOLOGIES INC

unknown

EAR99

8542.32.00.51

NX25P20-VNI-G

Nexflash Technologies Inc

Check for Price

Yes

Transferred

2.0972 Mbit

256KX8

3 V

40 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

25 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

NEXFLASH TECHNOLOGIES INC

unknown

EAR99

8542.32.00.51

NX25P20-VNI

Winbond Electronics Corp

Check for Price

Obsolete

2.0972 Mbit

256KX8

3 V

25 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

25 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

WINBOND ELECTRONICS CORP

SOIC

0.150 INCH, SOIC-8

not_compliant

EAR99

8542.32.00.51

NX25P20-VNI-T

Nexflash Technologies Inc

Check for Price

Transferred

NEXFLASH TECHNOLOGIES INC

unknown

EAR99

8542.32.00.51

NX25P20-VNI-T

Winbond Electronics Corp

Check for Price

Obsolete

2.0972 Mbit

256KX8

3 V

40 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

WINBOND ELECTRONICS CORP

not_compliant

EAR99

8542.32.00.51

NX25P20-VNI-C

Winbond Electronics Corp

Check for Price

Obsolete

2.0972 Mbit

256KX8

3 V

40 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

WINBOND ELECTRONICS CORP

not_compliant

EAR99

8542.32.00.51

NX25P20-VNI-C

Nexflash Technologies Inc

Check for Price

Transferred

NEXFLASH TECHNOLOGIES INC

unknown

EAR99

8542.32.00.51

NX25P20-VNI-GT

Winbond Electronics Corp

Check for Price

Yes

Obsolete

2.0972 Mbit

256KX8

3 V

40 MHz

FLASH

100000 Write/Erase Cycles

256000

262.144 k

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

5 µA

18 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

1.72 mm

4.85 mm

3.9 mm

WINBOND ELECTRONICS CORP

SOP, SOP8,.25

compliant

EAR99

8542.32.00.51

NX25P20-VNI-GT

Nexflash Technologies Inc

Check for Price

Transferred

NEXFLASH TECHNOLOGIES INC

unknown

EAR99

8542.32.00.51