Findchips: Parametric Search Results for NAND01GW4B2CZA6

Parametric results for: NAND01GW4B2CZA6 under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		NAND01GW4B2CZA6T Numonyx Memory Solutions
		NAND01GW4B2CZA6E Micron Technology Inc
		NAND01GW4B2CZA6T STMicroelectronics
		NAND01GW4B2CZA6F STMicroelectronics
		NAND01GW4B2CZA6T Micron Technology Inc
		NAND01GW4B2CZA6 STMicroelectronics
		NAND01GW4B2CZA6E Numonyx Memory Solutions
		NAND01GW4B2CZA6 Micron Technology Inc
		NAND01GW4B2CZA6F Numonyx Memory Solutions
		NAND01GW4B2CZA6 Numonyx Memory Solutions

				Most Relevant					Technical														Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Type	Write Cycle Time-Max (tWC)	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

Check for Price Buy

Yes

Obsolete

1.0737 Gbit

64MX16

3 V

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B63

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.51

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

STMICROELECTRONICS

BGA

TFBGA,

compliant

EAR99

8542.32.00.51

Check for Price Buy

Yes

Transferred

1.0737 Gbit

64MX16

3 V

25 µs

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

STMICROELECTRONICS

BGA

TFBGA,

compliant

EAR99

8542.32.00.51

Check for Price Buy

Obsolete

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NAND TYPE

R-PBGA-B63

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

STMICROELECTRONICS

BGA

TFBGA,

compliant

EAR99

8542.32.00.51

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

25 µs

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

25 ms

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.05 mm

11 mm

9 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

Check for Price Buy

Obsolete

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NAND TYPE

R-PBGA-B63

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

25 µs

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

25 ms

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.05 mm

11 mm

9 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

1 2 Next

Compare

NAND01GW4B2CZA6T

Numonyx Memory Solutions

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

NAND01GW4B2CZA6E

Micron Technology Inc

Check for Price Buy

Yes

Obsolete

1.0737 Gbit

64MX16

3 V

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B63

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.51

NAND01GW4B2CZA6T

STMicroelectronics

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

STMICROELECTRONICS

BGA

TFBGA,

compliant

EAR99

8542.32.00.51

NAND01GW4B2CZA6F

STMicroelectronics

Check for Price Buy

Yes

Transferred

1.0737 Gbit

64MX16

3 V

25 µs

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

STMICROELECTRONICS

BGA

TFBGA,

compliant

EAR99

8542.32.00.51

NAND01GW4B2CZA6T

Micron Technology Inc

Check for Price Buy

Obsolete

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NAND TYPE

R-PBGA-B63

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

NAND01GW4B2CZA6

STMicroelectronics

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

STMICROELECTRONICS

BGA

TFBGA,

compliant

EAR99

8542.32.00.51

NAND01GW4B2CZA6E

Numonyx Memory Solutions

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

25 µs

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

25 ms

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.05 mm

11 mm

9 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

NAND01GW4B2CZA6

Micron Technology Inc

Check for Price Buy

Obsolete

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NAND TYPE

R-PBGA-B63

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

NAND01GW4B2CZA6F

Numonyx Memory Solutions

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

25 µs

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

25 ms

R-PBGA-B63

Not Qualified

85 °C

-40 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.05 mm

11 mm

9 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

NAND01GW4B2CZA6

Numonyx Memory Solutions

Check for Price Buy

Transferred

1.0737 Gbit

64MX16

3 V

35 ns

FLASH

64000000

67.1089 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B63

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.05 mm

12 mm

9.5 mm

NUMONYX

BGA

TFBGA,

unknown

EAR99

8542.32.00.51

1 2 Next