Filter Your Search
1 - 3 of 3 results
|
NAND01GW3B2CZA6E
STMicroelectronics
|
Check for Price | Yes | Transferred | 1.0737 Gbit | 8 | 128MX8 | 3 V | 25 µs | FLASH | 1 | 128000000 | 134.2177 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B63 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 63 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.05 mm | 11 mm | 9 mm | STMICROELECTRONICS | BGA | TFBGA, | 63 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||||||
|
NAND01GW3B2CZA6E
Micron Technology Inc
|
Check for Price | Yes | Obsolete | 1.0737 Gbit | 8 | 128K | 128MX8 | 3 V | 25 µs | FLASH | YES | NO | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3 V | YES | 50 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | 25 ms | R-PBGA-B63 | Not Qualified | e1 | 85 °C | -40 °C | 260 | 30 | 63 | PLASTIC/EPOXY | TFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.05 mm | 11 mm | 9 mm | MICRON TECHNOLOGY INC | BGA | TFBGA, BGA63,10X12,32 | 63 | unknown | EAR99 | 8542.32.00.51 | Micron | ||
|
NAND01GW3B2CZA6E
Numonyx Memory Solutions
|
Check for Price | Yes | Transferred | 1.0737 Gbit | 8 | 128K | 128MX8 | 3 V | 25 µs | FLASH | YES | NO | 1 | 1K | 128000000 | 134.2177 M | ASYNCHRONOUS | 2K words | PARALLEL | 3 V | YES | 50 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | 25 ms | R-PBGA-B63 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 63 | PLASTIC/EPOXY | TFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.05 mm | 11 mm | 9 mm | NUMONYX | BGA | TFBGA, BGA63,10X12,32 | 63 | unknown | EAR99 | 8542.32.00.51 |