Parametric results for: NAND01GR3B2B under Flash Memories

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Manufacturer Part Number: nand01gr3b2b
Select parts from the table below to compare.
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NAND01GR3B2BZA1F
Micron Technology Inc
NAND01GR3B2BV1F
STMicroelectronics
NAND01GR3B2BZA6F
Micron Technology Inc
NAND01GR3B2BV6E
Numonyx Memory Solutions
NAND01GR3B2BZA1F
STMicroelectronics
NAND01GR3B2BZA1
Micron Technology Inc
NAND01GR3B2BN6T
Micron Technology Inc
NAND01GR3B2BN1E
Numonyx Memory Solutions
NAND01GR3B2BN6T
Numonyx Memory Solutions
NAND01GR3B2BZA6T
Micron Technology Inc
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
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Pbfree Code
Rohs Code
Part Life Cycle Code
Memory Density
Memory Width Sector Size
Organization Supply Voltage-Nom (Vsup)
Access Time-Max
Memory IC Type
Command User Interface
Data Polling
Number of Functions Number of Sectors/Size
Number of Words Code Number of Words Operating Mode
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Parallel/Serial
Programming Voltage
Ready/Busy
Standby Current-Max
Supply Current-Max
Supply Voltage-Max (Vsup)
Supply Voltage-Min (Vsup)
Technology Temperature Grade
Toggle Bit
Type
JESD-30 Code
Qualification Status
JESD-609 Code
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Surface Mount
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Length
Width
Ihs Manufacturer
Part Package Code
Package Description
Pin Count
Reach Compliance Code
ECCN Code
HTS Code
Yes Yes Obsolete 1.0737 Gbit 8 128K 128MX8 1.8 V 30 ns FLASH YES NO 1 1K 128000000 134.2177 M ASYNCHRONOUS 2K words PARALLEL 1.8 V YES 50 µA 15 µA 1.95 V 1.7 V CMOS COMMERCIAL NO R-PBGA-B63 Not Qualified e1 70 °C 63 PLASTIC/EPOXY TFBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.05 mm 12 mm 9.5 mm MICRON TECHNOLOGY INC BGA TFBGA, BGA63,10X12,32 63 compliant EAR99 8542.32.00.51
Yes Transferred 1.0737 Gbit 8 128MX8 1.8 V 25 µs FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 1.95 V 1.7 V CMOS COMMERCIAL R-PDSO-G48 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY VSSOP RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 650 µm 15.4 mm 12 mm STMICROELECTRONICS SOIC VSSOP, 48 compliant EAR99 8542.32.00.51
Yes Yes Obsolete 1.0737 Gbit 8 128K 128MX8 1.8 V 30 ns FLASH YES NO 1 1K 128000000 134.2177 M ASYNCHRONOUS 2K words PARALLEL 1.8 V YES 50 µA 15 µA 1.95 V 1.7 V CMOS INDUSTRIAL NO SLC NAND TYPE R-PBGA-B63 Not Qualified e1 85 °C -40 °C 63 PLASTIC/EPOXY TFBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.05 mm 12 mm 9.5 mm MICRON TECHNOLOGY INC BGA TFBGA, BGA63,10X12,32 63 compliant EAR99 8542.32.00.51
Yes Obsolete 1.0737 Gbit 8 128MX8 1.8 V 25 µs FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 15 µA 1.95 V 1.7 V CMOS INDUSTRIAL NAND TYPE R-PDSO-G48 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY VSSOP RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 650 µm 15.4 mm 12 mm NUMONYX SOIC VSSOP, 48 compliant EAR99 8542.32.00.51
Yes Transferred 1.0737 Gbit 8 128K 128MX8 1.8 V 25 µs FLASH YES NO 1 1K 128000000 134.2177 M ASYNCHRONOUS 2K words PARALLEL 1.8 V YES 50 µA 15 µA 1.95 V 1.7 V CMOS COMMERCIAL NO R-PBGA-B63 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 63 PLASTIC/EPOXY TFBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.05 mm 11 mm 9 mm STMICROELECTRONICS BGA TFBGA, BGA63,10X12,32 63 compliant EAR99 8542.32.00.51
Obsolete 1.0737 Gbit 8 128MX8 1.8 V 35 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 15 µA 1.95 V 1.7 V CMOS COMMERCIAL NAND TYPE R-PBGA-B63 70 °C 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.05 mm 12 mm 9.5 mm MICRON TECHNOLOGY INC BGA TFBGA, 63 unknown EAR99 8542.32.00.51
Obsolete 1.0737 Gbit 8 128MX8 1.8 V 35 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 15 µA 1.95 V 1.7 V CMOS INDUSTRIAL NAND TYPE R-PDSO-G48 85 °C -40 °C 48 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm MICRON TECHNOLOGY INC TSOP TSSOP, 48 unknown EAR99 8542.32.00.51
Yes Yes Transferred 1.0737 Gbit 8 128K 128MX8 1.8 V 25 µs FLASH YES NO 1 1K 128000000 134.2177 M ASYNCHRONOUS 2K words PARALLEL 1.8 V YES 50 µA 15 µA 1.95 V 1.7 V CMOS COMMERCIAL NO R-PDSO-G48 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY TSOP1 TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm NUMONYX TSOP TSOP1, TSSOP48,.8,20 48 unknown EAR99 8542.32.00.51
Transferred 1.0737 Gbit 8 128MX8 1.8 V 35 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 1.95 V 1.7 V CMOS INDUSTRIAL R-PDSO-G48 Not Qualified e0 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm NUMONYX TSOP TSOP1, 48 unknown EAR99 8542.32.00.51
Obsolete 1.0737 Gbit 8 128MX8 1.8 V 35 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 15 µA 1.95 V 1.7 V CMOS INDUSTRIAL NAND TYPE R-PBGA-B63 85 °C -40 °C 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.05 mm 12 mm 9.5 mm MICRON TECHNOLOGY INC BGA TFBGA, 63 unknown EAR99 8542.32.00.51
Compare
NAND01GR3B2BZA1F
Micron Technology Inc
Check for Price Buy Yes Yes Obsolete 1.0737 Gbit 8 128K 128MX8 1.8 V 30 ns FLASH YES NO 1 1K 128000000 134.2177 M ASYNCHRONOUS 2K words PARALLEL 1.8 V YES 50 µA 15 µA 1.95 V 1.7 V CMOS COMMERCIAL NO R-PBGA-B63 Not Qualified e1 70 °C 63 PLASTIC/EPOXY TFBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.05 mm 12 mm 9.5 mm MICRON TECHNOLOGY INC BGA TFBGA, BGA63,10X12,32 63 compliant EAR99 8542.32.00.51
NAND01GR3B2BV1F
STMicroelectronics
Check for Price Buy Yes Transferred 1.0737 Gbit 8 128MX8 1.8 V 25 µs FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 1.95 V 1.7 V CMOS COMMERCIAL R-PDSO-G48 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY VSSOP RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 650 µm 15.4 mm 12 mm STMICROELECTRONICS SOIC VSSOP, 48 compliant EAR99 8542.32.00.51
NAND01GR3B2BZA6F
Micron Technology Inc
Check for Price Buy Yes Yes Obsolete 1.0737 Gbit 8 128K 128MX8 1.8 V 30 ns FLASH YES NO 1 1K 128000000 134.2177 M ASYNCHRONOUS 2K words PARALLEL 1.8 V YES 50 µA 15 µA 1.95 V 1.7 V CMOS INDUSTRIAL NO SLC NAND TYPE R-PBGA-B63 Not Qualified e1 85 °C -40 °C 63 PLASTIC/EPOXY TFBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.05 mm 12 mm 9.5 mm MICRON TECHNOLOGY INC BGA TFBGA, BGA63,10X12,32 63 compliant EAR99 8542.32.00.51
NAND01GR3B2BV6E
Numonyx Memory Solutions
Check for Price Buy Yes Obsolete 1.0737 Gbit 8 128MX8 1.8 V 25 µs FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 15 µA 1.95 V 1.7 V CMOS INDUSTRIAL NAND TYPE R-PDSO-G48 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY VSSOP RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 650 µm 15.4 mm 12 mm NUMONYX SOIC VSSOP, 48 compliant EAR99 8542.32.00.51
NAND01GR3B2BZA1F
STMicroelectronics
Check for Price Buy Yes Transferred 1.0737 Gbit 8 128K 128MX8 1.8 V 25 µs FLASH YES NO 1 1K 128000000 134.2177 M ASYNCHRONOUS 2K words PARALLEL 1.8 V YES 50 µA 15 µA 1.95 V 1.7 V CMOS COMMERCIAL NO R-PBGA-B63 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 63 PLASTIC/EPOXY TFBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.05 mm 11 mm 9 mm STMICROELECTRONICS BGA TFBGA, BGA63,10X12,32 63 compliant EAR99 8542.32.00.51
NAND01GR3B2BZA1
Micron Technology Inc
Check for Price Buy Obsolete 1.0737 Gbit 8 128MX8 1.8 V 35 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 15 µA 1.95 V 1.7 V CMOS COMMERCIAL NAND TYPE R-PBGA-B63 70 °C 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.05 mm 12 mm 9.5 mm MICRON TECHNOLOGY INC BGA TFBGA, 63 unknown EAR99 8542.32.00.51
NAND01GR3B2BN6T
Micron Technology Inc
Check for Price Buy Obsolete 1.0737 Gbit 8 128MX8 1.8 V 35 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 15 µA 1.95 V 1.7 V CMOS INDUSTRIAL NAND TYPE R-PDSO-G48 85 °C -40 °C 48 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm MICRON TECHNOLOGY INC TSOP TSSOP, 48 unknown EAR99 8542.32.00.51
NAND01GR3B2BN1E
Numonyx Memory Solutions
Check for Price Buy Yes Yes Transferred 1.0737 Gbit 8 128K 128MX8 1.8 V 25 µs FLASH YES NO 1 1K 128000000 134.2177 M ASYNCHRONOUS 2K words PARALLEL 1.8 V YES 50 µA 15 µA 1.95 V 1.7 V CMOS COMMERCIAL NO R-PDSO-G48 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY TSOP1 TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm NUMONYX TSOP TSOP1, TSSOP48,.8,20 48 unknown EAR99 8542.32.00.51
NAND01GR3B2BN6T
Numonyx Memory Solutions
Check for Price Buy Transferred 1.0737 Gbit 8 128MX8 1.8 V 35 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 1.95 V 1.7 V CMOS INDUSTRIAL R-PDSO-G48 Not Qualified e0 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm NUMONYX TSOP TSOP1, 48 unknown EAR99 8542.32.00.51
NAND01GR3B2BZA6T
Micron Technology Inc
Check for Price Buy Obsolete 1.0737 Gbit 8 128MX8 1.8 V 35 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 1.8 V 15 µA 1.95 V 1.7 V CMOS INDUSTRIAL NAND TYPE R-PBGA-B63 85 °C -40 °C 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.05 mm 12 mm 9.5 mm MICRON TECHNOLOGY INC BGA TFBGA, 63 unknown EAR99 8542.32.00.51