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Parametric » Telecommunication Circuits » Network Interfaces

Parametric results for: MVTX2802AG under Network Interfaces

Select parts from the table below to compare.

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Select Parts		Part Number

		MVTX2802AG Conexant Systems Inc
		MVTX2802AG Microsemi Corporation
		MVTX2802AG Zarlink Semiconductor Inc

				Most Relevant	Technical			Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

No

No

Obsolete

2.5 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B596

Not Qualified

1

85 °C

-40 °C

596

PLASTIC/EPOXY

HBGA

BGA596,30X30,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

BALL

1.27 mm

BOTTOM

40 mm

40 mm

2.46 mm

CONEXANT SYSTEMS

BGA

HBGA, BGA596,30X30,50

596

compliant

8542.39.00.01

Check for Price

No

No

Transferred

2.5 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B596

e0

Not Qualified

1

85 °C

-40 °C

225

596

PLASTIC/EPOXY

HBGA

BGA596,30X30,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

40 mm

40 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

BGA

HBGA, BGA596,30X30,50

596

compliant

8542.39.00.01

Check for Price

No

Transferred

2.5 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B596

e0

Not Qualified

1

85 °C

-40 °C

225

596

PLASTIC/EPOXY

HBGA

BGA596,30X30,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

40 mm

40 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

HBGA, BGA596,30X30,50

compliant

8542.39.00.01

Compare

Telecommunication Circuits

Conexant Systems Inc

Check for Price

No

No

Obsolete

2.5 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B596

Not Qualified

1

85 °C

-40 °C

596

PLASTIC/EPOXY

HBGA

BGA596,30X30,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

BALL

1.27 mm

BOTTOM

40 mm

40 mm

2.46 mm

CONEXANT SYSTEMS

BGA

HBGA, BGA596,30X30,50

596

compliant

8542.39.00.01

Telecommunication Circuits

Microsemi Corporation

Check for Price

No

No

Transferred

2.5 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B596

e0

Not Qualified

1

85 °C

-40 °C

225

596

PLASTIC/EPOXY

HBGA

BGA596,30X30,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

40 mm

40 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

BGA

HBGA, BGA596,30X30,50

596

compliant

8542.39.00.01

Zarlink Semiconductor Inc

Check for Price

No

Transferred

2.5 V

LAN SWITCHING CIRCUIT

1

INDUSTRIAL

S-PBGA-B596

e0

Not Qualified

1

85 °C

-40 °C

225

596

PLASTIC/EPOXY

HBGA

BGA596,30X30,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

40 mm

40 mm

2.46 mm

ZARLINK SEMICONDUCTOR INC

HBGA, BGA596,30X30,50

compliant

8542.39.00.01