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MT9174AN
Zarlink Semiconductor Inc
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Check for Price | No | Transferred | 5 V | CMOS | 144 Mbps | DIGITAL SLIC | BASIC | 1 | 2.4 V | 5 mA | 400 mV | S | INDUSTRIAL | R-PDSO-G24 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 24 | PLASTIC/EPOXY | SSOP | SSOP24,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 5.3 mm | 8.2 mm | 2 mm | ZARLINK SEMICONDUCTOR INC | SSOP, SSOP24,.3 | compliant | 8542.39.00.01 | |||||
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MT9174AE
Zarlink Semiconductor Inc
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Check for Price | No | Obsolete | 5 V | CMOS | 144 Mbps | DIGITAL SLIC | BASIC | 1 | 2.4 V | 5 mA | 400 mV | S | INDUSTRIAL | R-PDIP-T24 | e0 | Not Qualified | 85 °C | -40 °C | 260 | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 31.623 mm | 5.334 mm | ZARLINK SEMICONDUCTOR INC | DIP, DIP24,.6 | compliant | 8542.39.00.01 | ||||||
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MT9174AE
Microsemi Corporation
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Check for Price | No | No | Transferred | 5 V | CMOS | 144 Mbps | DIGITAL SLIC | BASIC | 1 | 2.4 V | 5 mA | 400 mV | S | INDUSTRIAL | R-PDIP-T24 | e0 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MITEL SEMICONDUCTOR | DIP, DIP24,.6 | unknown | 8542.39.00.01 | DIP | 24 | |||||||
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MT9174AN1
Microsemi Corporation
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Check for Price | Yes | Transferred | 5 V | CMOS | DIGITAL SLIC | 1 | INDUSTRIAL | R-PDSO-G24 | e3 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 8.2 mm | 2 mm | MICROSEMI CORP | 5.30 MM, MO-150, SSOP-24 | compliant | 8542.39.00.01 | SSOP | 24 | ||||||||||||
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MT9174AN1
Microchip Technology Inc
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Check for Price | Yes | Obsolete | 5 V | CMOS | DIGITAL SLIC | 1 | INDUSTRIAL | R-PDSO-G24 | e3 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 8.2 mm | 2 mm | MICROCHIP TECHNOLOGY INC | 5.30 MM, MO-150, SSOP-24 | compliant | |||||||||||||||
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MT9174AP
Microsemi Corporation
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Check for Price | No | No | Transferred | 5 V | CMOS | 144 Mbps | DIGITAL SLIC | BASIC | 1 | 2.4 V | 5 mA | 400 mV | S | INDUSTRIAL | S-PQCC-J28 | e0 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 11.505 mm | 11.505 mm | 4.57 mm | MICROSEMI CORP | PLASTIC, MS-018AB, LCC-28 | unknown | 8542.39.00.01 | ||||||
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MT9174AN
Microsemi Corporation
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Check for Price | No | No | Transferred | 5 V | CMOS | 144 Mbps | DIGITAL SLIC | BASIC | 1 | 2.4 V | 5 mA | 400 mV | S | INDUSTRIAL | R-PDSO-G24 | e0 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | SSOP | SSOP24,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 5.3 mm | 8.2 mm | 2 mm | MICROSEMI CORP | 5.30 MM, MO-150AG, SSOP-24 | unknown | 8542.39.00.01 | SSOP | 24 | ||||
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MT9174AN1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 5 V | CMOS | DIGITAL SLIC | 1 | INDUSTRIAL | R-PDSO-G24 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 8.2 mm | 2 mm | ZARLINK SEMICONDUCTOR INC | 5.30 MM, MO-150, SSOP-24 | compliant | 8542.39.00.01 | ||||||||||||
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MT9174AP
Zarlink Semiconductor Inc
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Check for Price | No | Transferred | 5 V | CMOS | 144 Mbps | DIGITAL SLIC | BASIC | 1 | 2.4 V | 5 mA | 400 mV | S | INDUSTRIAL | S-PQCC-J28 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 11.505 mm | 11.505 mm | 4.57 mm | ZARLINK SEMICONDUCTOR INC | QCCJ, LDCC28,.5SQ | compliant | 8542.39.00.01 | |||||
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MT9174AP1
Microsemi Corporation
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Check for Price | Yes | Transferred | DIGITAL SLIC | MICROSEMI CORP | , | compliant | 8542.39.00.01 |