Parametric results for: MT9174 under Digital Transmission Interfaces

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Manufacturer Part Number: mt9174
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MT9174AN
Zarlink Semiconductor Inc
Check for Price No Transferred 5 V CMOS 144 Mbps DIGITAL SLIC BASIC 1 2.4 V 5 mA 400 mV S INDUSTRIAL R-PDSO-G24 e0 Not Qualified 1 85 °C -40 °C 260 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm ZARLINK SEMICONDUCTOR INC SSOP, SSOP24,.3 compliant 8542.39.00.01
MT9174AE
Zarlink Semiconductor Inc
Check for Price No Obsolete 5 V CMOS 144 Mbps DIGITAL SLIC BASIC 1 2.4 V 5 mA 400 mV S INDUSTRIAL R-PDIP-T24 e0 Not Qualified 85 °C -40 °C 260 24 PLASTIC/EPOXY DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 31.623 mm 5.334 mm ZARLINK SEMICONDUCTOR INC DIP, DIP24,.6 compliant 8542.39.00.01
MT9174AE
Microsemi Corporation
Check for Price No No Transferred 5 V CMOS 144 Mbps DIGITAL SLIC BASIC 1 2.4 V 5 mA 400 mV S INDUSTRIAL R-PDIP-T24 e0 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY DIP DIP24,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL MITEL SEMICONDUCTOR DIP, DIP24,.6 unknown 8542.39.00.01 DIP 24
MT9174AN1
Microsemi Corporation
Check for Price Yes Transferred 5 V CMOS DIGITAL SLIC 1 INDUSTRIAL R-PDSO-G24 e3 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm MICROSEMI CORP 5.30 MM, MO-150, SSOP-24 compliant 8542.39.00.01 SSOP 24
MT9174AN1
Microchip Technology Inc
Check for Price Yes Obsolete 5 V CMOS DIGITAL SLIC 1 INDUSTRIAL R-PDSO-G24 e3 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm MICROCHIP TECHNOLOGY INC 5.30 MM, MO-150, SSOP-24 compliant
MT9174AP
Microsemi Corporation
Check for Price No No Transferred 5 V CMOS 144 Mbps DIGITAL SLIC BASIC 1 2.4 V 5 mA 400 mV S INDUSTRIAL S-PQCC-J28 e0 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm MICROSEMI CORP PLASTIC, MS-018AB, LCC-28 unknown 8542.39.00.01
MT9174AN
Microsemi Corporation
Check for Price No No Transferred 5 V CMOS 144 Mbps DIGITAL SLIC BASIC 1 2.4 V 5 mA 400 mV S INDUSTRIAL R-PDSO-G24 e0 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm MICROSEMI CORP 5.30 MM, MO-150AG, SSOP-24 unknown 8542.39.00.01 SSOP 24
MT9174AN1
Zarlink Semiconductor Inc
Check for Price Yes Transferred 5 V CMOS DIGITAL SLIC 1 INDUSTRIAL R-PDSO-G24 e3 Not Qualified 3 85 °C -40 °C 260 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm ZARLINK SEMICONDUCTOR INC 5.30 MM, MO-150, SSOP-24 compliant 8542.39.00.01
MT9174AP
Zarlink Semiconductor Inc
Check for Price No Transferred 5 V CMOS 144 Mbps DIGITAL SLIC BASIC 1 2.4 V 5 mA 400 mV S INDUSTRIAL S-PQCC-J28 e0 Not Qualified 1 85 °C -40 °C 260 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm ZARLINK SEMICONDUCTOR INC QCCJ, LDCC28,.5SQ compliant 8542.39.00.01
MT9174AP1
Microsemi Corporation
Check for Price Yes Transferred DIGITAL SLIC MICROSEMI CORP , compliant 8542.39.00.01