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MT9074APR
Zarlink Semiconductor Inc
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Check for Price | No | Obsolete | 5 V | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | 200 mA | INDUSTRIAL | S-PQCC-J68 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | ZARLINK SEMICONDUCTOR INC | QCCJ, LDCC68,1.0SQ | compliant | 8542.39.00.01 | ||||||
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MT9074APR1
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | 5 V | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | 200 mA | INDUSTRIAL | S-PQCC-J68 | e3 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | MICROSEMI CORP | LEAD FREE, PLASTIC, MS-018AE, LCC-68 | compliant | 8542.39.00.01 | LCC | 68 | |||||
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MT9074APR1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 5 V | FRAMER | 1 | INDUSTRIAL | S-PQCC-J68 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 68 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | ZARLINK SEMICONDUCTOR INC | LEAD FREE, PLASTIC, MS-018AE, LCC-68 | compliant | 8542.39.00.01 | |||||||||
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MT9074APR1
Microchip Technology Inc
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Check for Price | Yes | Obsolete | 5 V | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | 200 mA | INDUSTRIAL | S-PQCC-J68 | e3 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | MICROCHIP TECHNOLOGY INC | LEAD FREE, PLASTIC, MS-018AE, LCC-68 | compliant |