Parametric results for: MT8889CN1 under Telecom Signaling Circuits
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MT8889CN1
Microchip Technology Inc
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$4.5600 | Yes | Active | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 11 mA | INDUSTRIAL | R-PDSO-G24 | e3 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | SSOP | SSOP24,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 8.2 mm | 2 mm | MICROCHIP TECHNOLOGY INC | 5.30 MM, LEAD FREE, MO-150AG, SSOP-24 | compliant | Microchip | ||||||||
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MT8889CN1
Microsemi Corporation
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$5.9605 | Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 11 mA | INDUSTRIAL | R-PDSO-G24 | e3 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | SSOP | SSOP24,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 8.2 mm | 2 mm | MICROSEMI CORP | 5.30 MM, LEAD FREE, MO-150AG, SSOP-24 | compliant | Microsemi Corporation | SSOP | 24 | 8542.39.00.01 | ||||
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MT8889CN1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 11 µA | INDUSTRIAL | R-PDSO-G24 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 24 | PLASTIC/EPOXY | SSOP | SSOP24,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 8.2 mm | 2 mm | ZARLINK SEMICONDUCTOR INC | 5.30 MM, LEAD FREE, MO-150AG, SSOP-24 | compliant | 8542.39.00.01 | ||||||
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MT8889CN-1
Microsemi Corporation
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Check for Price | Yes | Transferred | 5 V | DTMF SIGNALING CIRCUIT | 1 | 11 mA | INDUSTRIAL | R-PDSO-G24 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | MITEL SEMICONDUCTOR | , | unknown | SSOP | 24 | 8542.39.00.01 |