Filter Your Search
1 - 8 of 8 results
Select Parts | Part Number |
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MT8870DSR1
Microsemi Corporation
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MT8870DSR
Zarlink Semiconductor Inc
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MT8870DSR
Microsemi Corporation
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MT8870DSR1-1
Microsemi Corporation
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MT8870DSR-1
Microsemi Corporation
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MT8870DSR1
Zarlink Semiconductor Inc
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MT8870DSR1-1
Zarlink Semiconductor Inc
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MT8870DSR1
Microchip Technology Inc
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Supply Voltage-Nom | Technology |
Telecom IC Type
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Number of Functions |
Supply Current-Max
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Temperature Grade
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JESD-30 Code
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JESD-609 Code
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Qualification Status
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Width
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Length
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Seated Height-Max
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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HTS Code
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Samacsys Manufacturer
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Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | MICROSEMI CORP | SOIC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | 18 | compliant | 8542.39.00.01 | Microsemi Corporation | ||||
No | Obsolete | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | ZARLINK SEMICONDUCTOR INC | 0.300 INCH, MS-013AB, SOIC-18 | unknown | 8542.39.00.01 | ||||||
No | No | Obsolete | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | MICROSEMI CORP | SOIC | 18 | unknown | 8542.39.00.01 | ||||||||
Yes | Yes | Obsolete | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | MICROSEMI CORP | SOIC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | 18 | compliant | 8542.39.00.01 | Microsemi Corporation | ||||
Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | ZARLINK SEMICONDUCTOR INC | SOIC | SOP, | 18 | compliant | |||||
Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | ZARLINK SEMICONDUCTOR INC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | compliant | 8542.39.00.01 | ||||||
Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | ZARLINK SEMICONDUCTOR INC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | compliant | 8542.39.00.01 | |||||||
Yes | Active | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | MICROCHIP TECHNOLOGY INC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | compliant | Microchip |
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MT8870DSR1
Microsemi Corporation
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$1.3540 | Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | MICROSEMI CORP | SOIC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | 18 | compliant | 8542.39.00.01 | Microsemi Corporation | |||||
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MT8870DSR
Zarlink Semiconductor Inc
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Check for Price | No | Obsolete | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | ZARLINK SEMICONDUCTOR INC | 0.300 INCH, MS-013AB, SOIC-18 | unknown | 8542.39.00.01 | |||||||
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MT8870DSR
Microsemi Corporation
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Check for Price | No | No | Obsolete | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | MICROSEMI CORP | SOIC | 18 | unknown | 8542.39.00.01 | |||||||||
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MT8870DSR1-1
Microsemi Corporation
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Check for Price | Yes | Yes | Obsolete | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | MICROSEMI CORP | SOIC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | 18 | compliant | 8542.39.00.01 | Microsemi Corporation | |||||
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MT8870DSR-1
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | ZARLINK SEMICONDUCTOR INC | SOIC | SOP, | 18 | compliant | ||||||
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MT8870DSR1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | ZARLINK SEMICONDUCTOR INC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | compliant | 8542.39.00.01 | |||||||
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MT8870DSR1-1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | ZARLINK SEMICONDUCTOR INC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | compliant | 8542.39.00.01 | ||||||||
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MT8870DSR1
Microchip Technology Inc
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Check for Price | Yes | Active | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 9 mA | INDUSTRIAL | R-PDSO-G18 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | MICROCHIP TECHNOLOGY INC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | compliant | Microchip |