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MT58L512Y36FF-8.5
Micron Technology Inc
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Check for Price | No | Transferred | 18.8744 Mbit | 36 | 512KX36 | 3.3 V | 8.5 ns | 100 MHz | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 10 mA | 3.14 V | 325 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | MICRON TECHNOLOGY INC | BGA | 13 X 15 MM, FBGA-165 | 165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | |||||
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MT58L512Y36FT-10
Micron Technology Inc
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Check for Price | No | Transferred | 18.8744 Mbit | 36 | 512KX36 | 3.3 V | 10 ns | 66 MHz | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 10 mA | 3.14 V | 250 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e0 | 70 °C | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | MICRON TECHNOLOGY INC | QFP | PLASTIC, TQFP-100 | 100 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | |||||
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MT58L512Y36FF-6.8IT
Micron Technology Inc
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Check for Price | Obsolete | MICRON TECHNOLOGY INC | , | unknown | EAR99 | 8542.32.00.41 | ||||||||||||||||||||||||||||||||||||||||||||||||
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MT58L512Y36FF-7.5
Micron Technology Inc
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Check for Price | No | Transferred | 18.8744 Mbit | 36 | 512KX36 | 3.3 V | 7.5 ns | 113 MHz | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | PARALLEL | 10 mA | 3.14 V | 375 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | MICRON TECHNOLOGY INC | BGA | 13 X 15 MM, FBGA-165 | 165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | |||||
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MT58L512Y36FF-10IT
Micron Technology Inc
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Check for Price | Obsolete | MICRON TECHNOLOGY INC | , | unknown | EAR99 | 8542.32.00.41 | ||||||||||||||||||||||||||||||||||||||||||||||||
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MT58L512Y36FB-8.5
Micron Technology Inc
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Check for Price | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 3.3 V | 8.5 ns | CACHE SRAM | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 70 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | MICRON TECHNOLOGY INC | BGA | BGA, | 119 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||
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MT58L512Y36FT-6.8
Micron Technology Inc
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Check for Price | Transferred | 18.8744 Mbit | 36 | 512KX36 | 3.3 V | 6.8 ns | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | 70 °C | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | MICRON TECHNOLOGY INC | QFP | LQFP, | 100 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||
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MT58L512Y36FF-10
Cypress Semiconductor
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Check for Price | No | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 3.3 V | 10 ns | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | TBGA, | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||
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MT58L512Y36FB-7.5
Micron Technology Inc
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Check for Price | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 3.3 V | 7.5 ns | CACHE SRAM | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | e1 | 70 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | MICRON TECHNOLOGY INC | BGA | BGA, | 119 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||
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MT58L512Y36FF-8.5
Cypress Semiconductor
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Check for Price | No | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 3.3 V | 8.5 ns | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | 1 | 512000 | 524.288 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | TBGA, | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 |