Parametric results for: MT58L512Y32P under SRAMs

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Manufacturer Part Number: mt58l512y32p
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MT58L512Y32PF-7.5
Cypress Semiconductor
Check for Price No Obsolete 16.7772 Mbit 32 512KX32 3.3 V 4 ns CACHE SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP BGA TBGA, 165 unknown 3A991.B.2.A 8542.32.00.41
MT58L512Y32PF-6
Micron Technology Inc
Check for Price No Transferred 16.7772 Mbit 32 512KX32 3.3 V 3.5 ns 166 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 3.14 V 475 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 70 °C 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm MICRON TECHNOLOGY INC BGA 13 X 15 MM, FBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
MT58L512Y32PF-5
Micron Technology Inc
Check for Price No Transferred 16.7772 Mbit 32 512KX32 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 3.14 V 525 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 70 °C 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm MICRON TECHNOLOGY INC BGA 13 X 15 MM, FBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
MT58L512Y32PF-7.5IT
Micron Technology Inc
Check for Price Obsolete MICRON TECHNOLOGY INC , unknown EAR99 8542.32.00.41
MT58L512Y32PF-6IT
Micron Technology Inc
Check for Price Obsolete MICRON TECHNOLOGY INC , unknown EAR99 8542.32.00.41
MT58L512Y32PT-7.5
Micron Technology Inc
Check for Price No Transferred 16.7772 Mbit 32 512KX32 3.3 V 4 ns 133 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 3.14 V 675 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 70 °C 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm MICRON TECHNOLOGY INC QFP PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
MT58L512Y32PT-7.5IT
Micron Technology Inc
Check for Price Obsolete MICRON TECHNOLOGY INC , unknown EAR99 8542.32.00.41
MT58L512Y32PF-5IT
Micron Technology Inc
Check for Price Obsolete MICRON TECHNOLOGY INC , unknown EAR99 8542.32.00.41
MT58L512Y32PB-10
Micron Technology Inc
Check for Price No Obsolete 16.7772 Mbit 32 512KX32 3.3 V 5 ns 100 MHz STANDARD SRAM COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 3.14 V 525 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 70 °C 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.4 mm 22 mm 14 mm MICRON TECHNOLOGY INC BGA PLASTIC, MS-028BHA, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
MT58L512Y32PT-10
Micron Technology Inc
Check for Price No Transferred 16.7772 Mbit 32 512KX32 3.3 V 5 ns 100 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 3.14 V 525 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 70 °C 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm MICRON TECHNOLOGY INC QFP PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41