Findchips: Parametric Search Results for MT58L128L32D&

Parametric results for: MT58L128L32D& under SRAMs

Select parts from the table below to compare.

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Select Parts		Part Number

		MT58L128L32D1F-6IT Micron Technology Inc
		MT58L128L32D1B-7.5 Micron Technology Inc
		MT58L128L32D1T-6 Micron Technology Inc
		MT58L128L32D1T-6 Rochester Electronics LLC
		MT58L128L32D1-7.5T Micron Technology Inc
		MT58L128L32D1B-10IT Micron Technology Inc
		MT58L128L32D1T-6IT Cypress Semiconductor
		MT58L128L32D1B-5 Micron Technology Inc
		MT58L128L32DT-10 Micron Technology Inc
		MT58L128L32D1F-6 Rochester Electronics LLC

			Most Relevant						Technical																Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

4.1943 Mbit

128KX32

3.3 V

3.5 ns

STANDARD SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

MICRON TECHNOLOGY INC

BGA

TBGA,

165

unknown

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

4.1943 Mbit

128KX32

3.3 V

4 ns

133 MHz

STANDARD SRAM

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

375 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

MICRON TECHNOLOGY INC

BGA

14 X 22 MM, PLASTIC, MS-028BHA, BGA-119

119

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

4.1943 Mbit

128KX32

3.3 V

3.5 ns

166 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

475 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Active

4.1943 Mbit

128KX32

3.3 V

3.5 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

COMMERCIAL

70 °C

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

ROCHESTER ELECTRONICS LLC

QFP

LQFP,

100

unknown

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

4 ns

133 MHz

STANDARD SRAM

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

375 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

QFP

QFP100,.63X.87

RECTANGULAR

FLATPACK

YES

Tin/Lead (Sn/Pb)

GULL WING

635 µm

QUAD

MICRON TECHNOLOGY INC

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

5 ns

STANDARD SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

MICRON TECHNOLOGY INC

BGA

BGA,

119

unknown

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

3.5 ns

CACHE SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

QFP

LQFP,

100

unknown

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

2.8 ns

STANDARD SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

MICRON TECHNOLOGY INC

BGA

BGA,

119

unknown

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.1943 Mbit

512KX8

3.3 V

5 ns

100 MHz

CACHE SRAM

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

300 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

PLASTIC, MS-026BHA, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Not Recommended

4.1943 Mbit

128KX32

3.3 V

3.5 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

COMMERCIAL

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

ROCHESTER ELECTRONICS INC

BGA

TBGA,

165

unknown

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Compare

MT58L128L32D1F-6IT

Micron Technology Inc

Check for Price

Transferred

4.1943 Mbit

128KX32

3.3 V

3.5 ns

STANDARD SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

MICRON TECHNOLOGY INC

BGA

TBGA,

165

unknown

3A991.B.2.A

8542.32.00.41

MT58L128L32D1B-7.5

Micron Technology Inc

Check for Price

Transferred

4.1943 Mbit

128KX32

3.3 V

4 ns

133 MHz

STANDARD SRAM

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

375 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

MICRON TECHNOLOGY INC

BGA

14 X 22 MM, PLASTIC, MS-028BHA, BGA-119

119

not_compliant

3A991.B.2.A

8542.32.00.41

MT58L128L32D1T-6

Micron Technology Inc

Check for Price

Transferred

4.1943 Mbit

128KX32

3.3 V

3.5 ns

166 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

475 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

MT58L128L32D1T-6

Rochester Electronics LLC

Check for Price

Active

4.1943 Mbit

128KX32

3.3 V

3.5 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

COMMERCIAL

70 °C

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

ROCHESTER ELECTRONICS LLC

QFP

LQFP,

100

unknown

MT58L128L32D1-7.5T

Micron Technology Inc

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

4 ns

133 MHz

STANDARD SRAM

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

375 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

QFP

QFP100,.63X.87

RECTANGULAR

FLATPACK

YES

Tin/Lead (Sn/Pb)

GULL WING

635 µm

QUAD

MICRON TECHNOLOGY INC

not_compliant

3A991.B.2.A

8542.32.00.41

MT58L128L32D1B-10IT

Micron Technology Inc

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

5 ns

STANDARD SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

MICRON TECHNOLOGY INC

BGA

BGA,

119

unknown

3A991.B.2.A

8542.32.00.41

MT58L128L32D1T-6IT

Cypress Semiconductor

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

3.5 ns

CACHE SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

QFP

LQFP,

100

unknown

3A991.B.2.A

8542.32.00.41

MT58L128L32D1B-5

Micron Technology Inc

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

2.8 ns

STANDARD SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

MICRON TECHNOLOGY INC

BGA

BGA,

119

unknown

3A991.B.2.A

8542.32.00.41

MT58L128L32DT-10

Micron Technology Inc

Check for Price

Obsolete

4.1943 Mbit

512KX8

3.3 V

5 ns

100 MHz

CACHE SRAM

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

300 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

PLASTIC, MS-026BHA, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

MT58L128L32D1F-6

Rochester Electronics LLC

Check for Price

Not Recommended

4.1943 Mbit

128KX32

3.3 V

3.5 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

COMMERCIAL

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

ROCHESTER ELECTRONICS INC

BGA

TBGA,

165

unknown

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